0.4mm Pitch, 3.38mm Depth, 125ºC Heat Resistance,
Board to Board/FPC to Board Connector for Automotive
【DF40T/DF40GT】

1. Space-saving Design and Wide Variations
2. 125℃ Heat Resistant Contact Design
3. World Longest Class Effective Mating Length
4. Guide Ribs for Wide Self Alignment Range
5. Supports PCI-ex Gen4(16Gbps)
6. Metal Shielding for Superior EMI 【DF40GT】
7. Reliable Ground Design 【DF40GT】

Small Floating Board to Board Connector, 125ºC Heat Resistance for Automotive

【DF40F】

1. 0.4mm Pitch, 3.68mm Width, Stacking Height 3.5 to 6.0mm World's Smallest Width Class in Floating Board to Board Connectors
2. Absorption of Misalignment
3. Wide Variety of Stacking Heights by Mating Combination with DF40T
4. 125℃ Heat Resistance for Automotive Specifications
5. Supports High Speed Transmission

[FunctionMAX™]

PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors

1. Pitch : 0.8mm
2. Variations : Right Angle / Parallel / Coplanar
3. Stacking Height : 7/9/10/12mm
4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos.
5. Large Guide for Easy Mating 
6. Unique Contact Design for Smooth Mating
7. Samtec “Edge Rate®” Licensed Second Source

[FunctionMAX™]

High Speed Transmission, 0.8mm Pitch Connectors for PCB Connections

1. 0.8mm pitch
2. Connection type: Coplanar/Right Angle/Parallel (Height: 10 to 45mm)
3. No of Pos.: 40, 60, 80, 100, 120, 140, 160, 180
4. MF (Multi-Functional) contact
5. Effective mating length of 2mm (Signal contact)
6. Resistant to excess mating force
7. Simplified mating with large guides

FX18H
0.8mm Pitch, Open Pluggable Specification 2.0 (OPS 2.0) Standard Connector
125℃ Heat-Resistant, Board-to-Board Horizontal Connection Connector

1   Open Pluggable Specification 2.0 (OPS 2.0) Standard Connector
     OPS is an Intel specification that serves as the industry-wide standard for digital signage, etc.  
2   High-Speed Variation of the FX18 Series
　 Enhancing high-speed performance by optimized contact shapes and configurations of the conventional FX18 Series.
3   125℃ Heat Resistance
4   Compatible Mating and Mounting Pattern with the FX18 Series

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm  Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin  Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm  Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin  Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

FX23LH

125℃, Floating Board-to-Board Connector with Power Contacts
1  Floating range: ±0.6mm in X and Y directions
2  High speed transmission capability
    Supports PCIe Gen.4 (16Gbps)
3  Supports 125℃ to meet automotive specs.
4  SMT mounting increases flexibility in component placement
5  Compatible Mating with FX23/FX23L

[FunctionMAX™]
140℃ Heat and Vibration Resistant Board-to-Board Floating Connector
1. Vibration Resistance
2. Heat Resistance up to 140℃
3. Board Misalignment Absorption
　・X and Y Directions : ±0.7mm Floating Range
　・Z Direction : ±0.75mm Effective Mating Length
4. Contact Pitch : 1mm
5. Connection Type : Stacking
　 Height : 15mm/18mm/20mm/23mm/25mm
6. Pin Count Variations : 20/30/40/50/60
7. Rated Current : 0.5A/pin
8. Pick and Place Mounting
9. Excellent mating performance with large guide post

Received "CES 2020 Innovation Awards" in Vehicle Intelligence & Transportation category. 

[FunctionMAX™]

13 to 25A Compatible, Position Misalignment Absorption Type
Power Supply Connector for PCB Connections

1. Contact Pitch: 3.81mm, 7.62mm
2. Current Capacity: 13-25A/pin
3. Connection Type: Parallel, Coplanar, Right Angle
4. No. of Pos.: 2 / 3 / 4 / 5pos.
5. Position Misalignment Absorption Range:±0.3 mm
6. Effective Mating Length: 2mm
7. Multi-point Contact Design
8. Low Insertion / Extraction Force
9. Robustness
10. Large Guide For Superior Mating Ability
11. Protected mating face design
12. UL, C-UL and TÜV certified.

Power Connections for Internal Automotive Applications — Floating Connector

1. Vibration Resistance
2. Heat Resistance up to 125℃
3. Board Misalignment Absorption
 ・X and Y Directions: ±0.5mm Floating Range
 ・Z Direction: ±1.5mm Effective Mating Length
4. Contact Pitch: 9.5mm
5. Connection Type: Stacking (Height: 20mm)
6. Pin Count Variations: 2pin
7. Rated Current: 25A/pin

Mirror Mezz, High Speed, Low Height, BGA Mezzanine Connector

1  Molex “Mirror Mezz” Licensed Second Source

2  High Speed Transmission (56⁺Gbps NRZ / 112⁺Gbps PAM4)

3  OAM Specified Connector

4  High Pin Count, High Density:
    404pos. (101 Differential Pairs), 688pos. (172 Differential Pairs)

5  Hermaphroditic Connector

6  Stub-less 2-point Contact Design

7   Protective Housing that Encapsulates the Contact Tips
     Prevents Warping During Mating

BGA Mezzanine Connector Supporting 10⁺Gbps

1. Original 3 piece design
2. Stacking Height: 17-42mm
3. Staggered1.5mm×1.75mmball grid array
4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds)
5. Differential, single-ended and power
6. Low mating/extracting forces for easy operability
7. Wide mating misalignment tolerances for multiple connector use
8. Can be used to provide high current when used with IT-P

Hochgeschwindigkeit (25⁺Gbps) BGA Mezzanine Steckverbinder

Hirose's IT5 mezzanine Steckverbindersystem ist heutzutage mit den PCIe und XAUI Datenraten genauso komfortabel zu nutzen, wie in zukunftigen 25+ Gbps Systemen. Mit der Moglichkeit differentielle Signale, einzelne Signale und Leistung gemeinsam zu verbinden, sowie von 14 bis 40 mm stapelbar zu sein, kann IT5 Ihre Anschlussherausforderungen sowohl heute, als auch fur zukunftige Generationen losen.

Hochgeschwindigkeits-BGA-Mezzanine-Anschlüsse mit 56 Gbit/s

[Mechanische Merkmale]

1. Stapelhöhen
 Zweiteiliger Typ: 10 bis 13mm

Dreiteiliger Typ: 14 bis 46 mm
2. Erhältlich mit 120, 192 oder 288 Signalkontakten.
3. Mehrfachbelegung
4. Paarungsausrichtung: +/-1,5 mm
5. "Pin in Ball"-BGA-Anschluss
6. Kompatibel mit doppelseitigem und invertiertem Reflow-Löten
7. 1,0 mm BGA-Zeilenabstand für hohe Signaldichte

[Signalintegritätsfunktionen]
8. SI-Fähigkeit
9. Einzigartige Polaritäts-Swap-FEXT-Cancelling-Technologie

10. Quasi-koaxiale Bauweise

60 A/70 A Nennstrom, Board-to-Board-Netzanschluss

1. 60/70A pro Pin Stromaufnahme
2. Stapelhöhen-Variation : 10 bis 66mm
3. 3-teiliges Design
4. Tonhöhe: 10,8 mm und 12 mm Stiftpaste in Loch (PIH)
5. Geeignet für den Einsatz mit Hochgeschwindigkeits-Übertragungs-Mezzanine-Anschlüssen IT3, IT5 und IT8.

0.5mm Pitch, 21mm Stacking Height,
125℃ Heat Resistant, Floating Board-to-Board Connector

1 Wide ±0.8mm floating range in the X and Y directions
2 High speed transmission (8Gbps)
3 Shield and grounding provide EMI protection
4 Wide self-alignment range : ±1.2mm in X and Y directions
5 Power contacts on each side of the connector (3A/Contact × 4 Contacts) 

7.4mm Mated Height　RF Board-to-Board Connector for Automotive

1 Low Profile RF Board-to-Board connector (Mated height : 7.4mm)
2 Meets severe automotive requirements
3 Mating failure minimized with clear tactile click
4 Easy to check the mounting direction using the polarity key
5 Excellent high frequency performance - V.S.W.R. : 1.5 Max. (0 to 3GHz)
6 Suitable for Automotive applications such as Wireless phone charger, Infotainment, Telematics, Camera and Antenna

9mm/12mm Mated Height RF Board-to-Board/Wire-to-Board Connector for Automotive

1. Low profile RF Connector
　- Board-to-Board : 9mm Mated Height
　- Wire-to-Board : 12mm Mated Height
2. Choice of two connection methods improves board design flexibility
3. Mating failure minimized with clear tactile click
4. Excellent high frequency performance - V.S.W.R. : 1.5 Max. (DC to 6GHz)
5. Meets severe automotive requirements
6. Suitable for Automotive applications such as Infotainment, Telematics, Camera and Antenna

0.4mm Pitch, 0.8mm Height, FPC-to-Board Connectors

1. Stacking height : 0.8mm
2. Ultra space-saving design
3. Two point contact system
4. Superior tactile feedback
5. Drop and shock resistant structure
6. User friendly operations
7. No pattern prohibited area

[SignalBee™]
2.0mm Pitch, Double-Row Connector (UL/CSA Compliant)

1. Space-saving on Board
2. Wide Varieties
3. Wide Applicable Wire Range