All ProductsBM29

Features

Ultra-small, power/signal contact design for Board-to-Board/FPC-to-Board providing 3A max current

1. Space-saving design
Compact and flexible design ideal for mobile devices.
・Pitch : 0.35mm, Depth : 1.5mm, Stacking height : 0.6mm
2. Equipped with power contacts capable of handling up to 3A current.
・ Rated current : 3A (power contact), 0.3A (signal contact)
3. The proprietary metal guide prevents the connector from being damaged against offset mating.
4. A tactile click ensures secure mating.
5. 2-points of contact offer high contact reliability.

Specifications

Mated Height to mm
Catalog Product Series Catalog DOWNLOAD
Data Sheet Simulation Model (Touchstone)
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Signal Integrity Report
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Products

PART NUMBER CONFIGURATION

Number of Positions   pos. Connection Style  

Connector Orientation

Mated Height

  mm

Positioning Boss

 

Part No.

Catalog

Drawing

Number of Positions

Connector Height

Connector Orientation

Mated Height (Min.)

Mated Height (Max.)

Mated Height

Positioning Boss