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IT2 Series

High Speed, Parallel BtoB, 380-Pin, Ball-Grid Array Termination


Features

High Speed, Parallel Board-to-Board Connector 380 contacts,Ball-Grid array termination

1. High-speed transmission
2. Contact reliability
3. Self-alignment
4. Low insertion / withdrawal forces
5. Customized Board-to-Board distance

Specifications

  • Connector Type
  • Receptacle, Interposer
  • Parts
  • Industry Standard
  • Safety Standards
  • Performance Characteristics
  • Ethernet, Fiber channel, Infiniband, SAS, SATA, PCIe
  • Transmission Rate
  • 5.0 Gbps
  • Contact Pitch
  • 2.0 mm
  • Mounting Pitch
  • 2.0 mm
  • Tab Width (mm)
  • Mated Height (Min.)
  • 15.0, 17.0, 20.0, 25.0, 26.0, 30.0, 32.2, 35.0 mm
  • Mated Height (Max.)
  • 15.0, 17.0, 20.0, 25.0, 26.0, 30.0, 32.2, 35.0 mm
  • Mated Height (STEP)
  • 15.0, 17.0, 20.0, 22.2, 25.0, 26.0, 30.0, 32.2, 35.0 mm
  • Number of Positions
  • 180, 200, 380
  • Remarks on Number of Positions
  • Floating Design
  • Yes
  • Mating/Unmating Cycles
  • 20
  • Mounting Style
  • BGA
  • Connector Orientation
  • Straight
  • Contact Plating
  • Gold
  • Rated Current
  • 0.5 A
  • Rated Voltage (AC)
  • AC 50.0 V
  • Rated Voltage (DC)
  • Operating Temperature Max.
  • 85 ℃
  • Operating Temperature Min.
  • -55 ℃

In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information.