[FunctionMAX™]

PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors

1. Pitch : 0.8mm
2. Variations : Right Angle / Parallel / Coplanar
3. Stacking Height : 7/9/10/12mm
4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos.
5. Large Guide for Easy Mating 
6. Unique Contact Design for Smooth Mating
7. Samtec “Edge Rate®” Licensed Second Source

[FunctionMAX™]

High Speed Transmission, 0.8mm Pitch Connectors for PCB Connections

1. 0.8mm pitch
2. Connection type: Coplanar/Right Angle/Parallel (Height: 10 to 45mm)
3. No of Pos.: 40, 60, 80, 100, 120, 140, 160, 180
4. MF (Multi-Functional) contact
5. Effective mating length of 2mm (Signal contact)
6. Resistant to excess mating force
7. Simplified mating with large guides

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm  Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin  Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm  Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin  Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

[FunctionMAX™]

13 to 25A Compatible, Position Misalignment Absorption Type
Power Supply Connector for PCB Connections

1. Contact Pitch: 3.81mm, 7.62mm
2. Current Capacity: 13-25A/pin
3. Connection Type: Parallel, Coplanar, Right Angle
4. No. of Pos.: 2 / 3 / 4 / 5pos.
5. Position Misalignment Absorption Range:±0.3 mm
6. Effective Mating Length: 2mm
7. Multi-point Contact Design
8. Low Insertion / Extraction Force
9. Robustness
10. Large Guide For Superior Mating Ability
11. Protected mating face design
12. UL, C-UL and TÜV certified.

BGA Mezzanine Connector Supporting 10⁺Gbps

1. Original 3 piece design
2. Stacking Height: 17-42mm
3. Staggered1.5mm×1.75mmball grid array
4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds)
5. Differential, single-ended and power
6. Low mating/extracting forces for easy operability
7. Wide mating misalignment tolerances for multiple connector use
8. Can be used to provide high current when used with IT-P

High-Speed (25⁺Gbps) BGA Mezzanine Connectors

Hirose’s IT5 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 25⁺ Gbps systems. With the ability to transmit differential, singleended and power through one package and being stackable from 14 to 40 mm, IT5 can solve your interface needs for both current and future generations.

The IT8 mezzanine connector system was developed to enable 56Gbps performance with 
the highest signal density in the market, featuring Quasi-Coaxial Structure and
Polarity-Swap FEXT cancelling technology.
IT8 delivers the most reliable and flexible solution for your current and future needs
to design high speed systems.

Mechanical Features
1. Stacking heights :
-10 to 13mm (Two-piece type)
-14 to 46mm (Three-piece type)
2. No. of Pos. : 120, 192, 288 signals
3. Multiple mounting capability
±0.2mm floating range in X and Y directions
4. Mating alignment : ±1.5mm
5. 1.0×5.5mm BGA interface optimizes routing and SI performance
6. BGA attachment with “Pin in Ball” ensures reliable solder joints with high SMT
processing yields
7. Excellent reflow solderability with superior BGA coplanarity control
8. Compatible with double-sided and inverted reflow soldering

Signal Integrity Features
1. SI capability
-56⁺Gbps (18 to 46mm), 28⁺Gbps (10 to 16mm)
-92ohm impedance (suitable for both 100ohm & 85Ω system)
2. Unique Polarity-Swap FEXT cancelling technology
3. Quasi-Coaxial Structure to prevent noise emission to adjacent lines
4. Insertion loss to Crosstalk Ratio (ICR)

0.5mm Pitch High Speed Transmission, Right Angle Connector

1 High Speed Transmission (32⁺Gbps)
2 High Density : 50 Differential Pairs/Inch (224pos.)
3 Floating design enables mounting of multiple components on same board
4 Wide Varieties - No. of Pos.: 84pos., 152pos., 224pos.

60A/40A Board-to-Board Power Pin Connectors

1. Up to 60A/pin current rating
2. Unique 3-piece design for flexibility
3. Multiple mating capability (Floating range ±0.3mm)
4. Paste in hole reflow assembly
5. Stacking heights from 10 to 66mm
6. Designed to be used/assembled alongside IT3, IT5, and IT7

[FunctionMAX™]

15+Gbps 0.5mm pitch Stacking Connectors
Electrical Interface for the OIF 100G Long-Haul DWDM Transmission Module (MSA-100GLH)

1. 0.5mm Pitch
2. Stacking height: 4 to 8mm (2-piece type), 8 to 13mm (3-piece type)
3. OIF MSA-100GLH Electrical Interface
FX10A-168P/S-SV(83) assembly is specified for the OIF 100G Long-Haul DWDM Transmission Module host line card - MSA-100GLH electrical connector.
4. Suited to High-Density Applications
5. Optional Ground Plate: An alternate style without the ground plate is available.