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PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors
1. Pitch : 0.8mm 2. Variations : Right Angle / Parallel / Coplanar 3. Stacking Height : 7/9/10/12mm 4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos. 5. Large Guide for Easy Mating 6. Unique Contact Design for Smooth Mating 7. Samtec “Edge Rate®” Licensed Second Source
对应高速传输 0.8mm间距板对板连接器
1. 0.8mm间距 2. 连接方式:共面/垂直/平行(高度:10-45mm) 3. 芯数:40/60/80/100/120/140/160/180 4. MF端子,可用于多种用途 5. 有效嵌合长度2mm(信号端子) 6. 固定于基板的连接器两侧的Dip端子可增强上下・左右耐扭曲力。 7. 导向设计便于嵌合
1. Pitch: 0.5mm 2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle 3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power 4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm 5. Supports PCle Gen.4 (16Gbps) 6. Hybrid Power Design (3A/pin×4 lines) 7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin 8. Pick & Place (suction tape attached as standard) 9. Large guide post for excellent mating performance
13 to 25A Compatible, Position Misalignment Absorption Type Power Supply Connector for PCB Connections
1. Contact Pitch: 3.81mm, 7.62mm 2. Current Capacity: 13-25A/pin 3. Connection Type: Parallel, Coplanar, Right Angle 4. No. of Pos.: 2 / 3 / 4 / 5pos. 5. Position Misalignment Absorption Range:±0.3 mm 6. Effective Mating Length: 2mm 7. Multi-point Contact Design 8. Low Insertion / Extraction Force 9. Robustness 10. Large Guide For Superior Mating Ability 11. Protected mating face design 12. UL, C-UL and TÜV certified.
BGA Mezzanine Connector Supporting 10⁺Gbps 1. Original 3 piece design 2. Stacking Height: 17-42mm 3. Staggered1.5mm×1.75mmball grid array 4. No.of Pos.: 100,200,300(Signal)+ 90%(Additional Grounds) 5. Differential, single-ended and power 6. Low mating/extracting forces for easy operability 7. Wide mating misalignment tolerances for multiple connector use 8. Can be used to provide high current when used with IT-P
支持高速传输(25⁺Gbps)BGA Mezzanine连接器 广濑IT5转接连接器系统可对应于未来的25+ Gbps系统应用要求以及当今PCIe以及XAUI需求的数据传输速率. 因为它的差分单端传输能力,以及整体的通过电流以及多样化的装配高度14-40mm, IT5可同时解决接口对电流以及未来更新换代的需求
高速传输 BGA夹层连接器 【2片式】 1. 可对应高达28⁺Gbps的高速差分信号 2. 对应85/100Ω两种阻抗设计 3. 实装可靠性高的BGA构造“Pin in Ball” 4. 叠装高度:10,11,12,13mm 5. 允许多个实装构造±0.2mm(X,Y方向) 【3片式】 1. 可对应高达56⁺Gbps的高速差分信号 2. 对应85/100Ω两种阻抗设计 3. 实装可靠性高的BGA构造“Pin in Ball” 4. 叠装高度:14~46mm 5. 允许多个实装构造±0.2mm(X,Y方向)
0.5mm Pitch High Speed Transmission, Right Angle Connector
1 High Speed Transmission (32⁺Gbps) 2 High Density : 50 Differential Pairs/Inch (224pos.) 3 Floating design enables mounting of multiple components on same board 4 Wide Varieties - No. of Pos.: 84pos., 152pos., 224pos.
对应60A/40A 基板间大电流电源连接器
1. 每个引脚40A/60A 2. 3件式结构 3. 自调整大幅度浮动公差 (±0.3mm) 4. 10.8/12mm安装间距 5. 高度变化10-66mm 6. 可与高速传输夹层连接器IT3,IT5&IT7系列混合使用
15Gbps或更高的传输速率,0.5mm引脚间距装配连接器 对应OIF的100G电气接口长距离DWDM传输模块(MSA-100GLH)