DF13 Series, 1.25mm Pitch, Wire-to-Board Connectors
Hirose has introduced the DF13 series to deliver a wire-to-board connectivity solution for applications requiring multiple signals in a space-saving footprint for miniaturisation.
The connector range consists of crimp sockets, vertical headers, and right angle headers in single or double row to maximise space-saving. The mated height profile is minimised to 5.3mm (vertical, through-hole type) to maximise space above the connector.
The user-friendly connector design incorporates polarizing keys and a scoop proof robust box housing structure to prevent incorrect insertion and twisting when mating the connectors.
The surface-mount headers have sufficient flat surface areas to allow pick-up with vacuum nozzles of automatic placement equipment.
Metal fittings are provided on the headers to increase the retention of the connector to the board and prevent solder peeling.
· Contact positions: 2 - 18 (single row) / 20 - 40 (double row)
· Pitch: 1.25mm
· Current rating: 1A
· Voltage rating: AC150V
· Mating cycles: 30 Tin / 50 Gold
· Cable size: AWG 26 - 30
A wide range of applications are suitable such as digital cameras, PDA, LCD displays, digital video recorders, car navigation, access control units, measurement devices, set top box and many other portable devices.