Hirose's ultra-small, low profile, robust product line up dramatically increases the design design flexibility of wearables devices.
Hosted by Jeff Combs and Junya Doi
Webinar Will Cover:
・Trends impacting wearable electronics designs - smaller form factors, more modules, movement away from hand soldering assembly
・Methods to reduce PWB board space usage
・Methods to move connection points off the PWB and onto module flexes
・Methods to facilitate tight vertical board and module stacking in designs
・Methods to improve assembly of discreet wire harnesses in small form factor designs
・Smart watch/activity trackers
・AR/VR head mounted displays
・Wireless earbuds/hearing aids
・Other wearable devices (consumer/medical)
Connector Types Discussed:
・Micro Board to board/flex connectors
・Micro ZIF FPC connectors (sub 1mm Z H)
・Micro Board to wire connectors (sub 2mm Z H)
People who should attend include:
・R&D management, hardware and module R&D engineers
・Design engineers, hardware engineers, mechanical engineers, engineering management
Jeff Combs, Director of Sales, CE Segment at Hirose Electric USA. Over 20yrs experience in the consumer electronics market supporting Tier 1 smart phone and wearable electronics OEMs.
Junya Doi, Technical Marketing Specialist, experienced over 10 years as Product Planning manager in consumer market.