High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

支持高速传输（25⁺Gbps）BGA Mezzanine连接器

广濑IT5转接连接器系统可对应于未来的25+ Gbps系统应用要求以及当今PCIe以及XAUI需求的数据传输速率. 因为它的差分单端传输能力，以及整体的通过电流以及多样化的装配高度14-40mm, IT5可同时解决接口对电流以及未来更新换代的需求

高速传输 BGA夹层连接器

【2片式】
1. 可对应高达28⁺Gbps的高速差分信号
2. 对应85/100Ω两种阻抗设计
3. 实装可靠性高的BGA构造“Pin in Ball”
4. 叠装高度：10,11,12,13mm
5. 允许多个实装构造±0.2mm（X,Y方向）

【3片式】
1. 可对应高达56⁺Gbps的高速差分信号
2. 对应85/100Ω两种阻抗设计
3. 实装可靠性高的BGA构造“Pin in Ball”
4. 叠装高度：14～46mm
5. 允许多个实装构造±0.2mm（X,Y方向）