Home [Press Release] Hirose Electric’s New BM55 Series Has Been Selected as a CES® 2023 Innovation Awards Honoree for Board-to-Board/FPC Connector

Hirose Electric’s New BM55 Series Has Been Selected as a CES® 2023 Innovation Awards Honoree for Board-to-Board/FPC Connector
​​​​​​​November 16, 2022

Hirose Electric’s New BM55 Series Has Been Selected
as a CES® 2023 Innovation Awards Honoree for
Board-to-Board/FPC Connector with 0.3mm Pitch,
0.5mm Mated Height and a Current Capacity of up to 5A

We are pleased to announce that Hirose’s newly released compact board-to-board/FPC connector, the BM55 Series, has been recognized as a CES® Innovation Awards* Honoree in the Wearable Technologies category. Selection for the CES® 2023 Innovation Awards program was held prior to the Consumer Electronics Show (CES) 2023, the world’s largest trade show. The BM55 Series is an innovative connector that combines a current capacity of up to 5A along with a robustness and fully armored design despite it’s extremely small size (0.3m Pitch, 0.5mm stacking height, and 1.5mm depth). This is the fourth time Hirose products have been selected as Innovation Awards Honorees, following the BM50 Series at CES 2022.

BM55 Series
CES2023 Innovation Award Honoree

● About CES® 2023 Innovation Awards

CES® 2023 Innovation Awards program occurred ahead of CES, the world's largest consumer electronics trade show, which is held every January in Las Vegas, USA. The awards program is an international competition hosted by the Consumer Technology Association® (CTA) that honors outstanding design and engineering in 28product categories. A panel of experts in the consumer electronics industry consisting of media members, designers, and engineers evaluate submissions based on engineering, functionality, aesthetic, design, and what makes the product unique and innovative. This year’s honorees were selected from a record number of over 2,100 submissions.

● About the BM55 Series

In recent years, wearable devices smartphones have become increasingly smaller and thinner. The BM29 Series, a small Board-to-Board/FPC connector released by Hirose in 2015, is used in many compact consumer devices even today. However, further size reduction and robustness are required for connectors as consumer electronics evolve.
The BM55 Series was developed in response to this transformation in consumer devices. The BM55 Series successfully reduces the pitch by 0.05mm and mated height by 0.1mm while maintaining the same 1.5mm depth when compared to the BM29 Series. Small connectors with low pin counts tend to be inferior to larger, high-pin counts connectors in terms of mating retention force, but the BM55 Series achieves high mating retention force and a compact size due to its unique contact locking design. In addition, the fully armored design covers the housing with metal, preventing housing breakage during mating. The header contact material has excellent conductivity, supporting a current capacity up to 5A.

■BM55 Series Dimensions (2pos.)

 Mated Height: 0.5mm

BM55 Dimensions

Features: Ultra Compact, Full Armored, Board-to-Board/FPC Connector
1. Ultra small Board-to-Board/FPC connector with 0.5mm mated height, 0.3mm pitch, 1.5mm depth
2. Supports up to 5A
    - Power contact: 5A, Signal contact: 0.3A
3. Fully armored design ensures high robustness and extraction force
4. Clear tactile click even at a compact size

● Future Product Development

The newly developed BM55 Series helps solve problems in wearable devices and smartphones. We plan to add 4 and 6pos. pin count variations in the future.
In April 2022, Hirose also released another Board-to-FPC/Board connector, the BK10 Series, which differs in size from the BM55 Series (1.7mm depth). Our wide lineup allows you to choose the best-suited connector based on your application needs. Hirose will continue to respond to diversifying interconnect needs and contribute to the transformation of devices.

● Corporate Profile

*The CES Innovation Awards are based upon descriptive materials submitted to the judges. CTA did not verify the accuracy of any submission or of any claims made and did not test the item to which the award was given.