Presenter: Jeremiah Stanek
Webinar Will Cover:
・Achieving high-definition visual images due to increasing demand of high-speed transmission.
・Miniaturizing interconnect technology to achieve minimal invasiveness.
・Heat dissipation to minimize loss of component’s current-carrying capacity.
< Connections inside the scope >
Processor, Operation Unit, Tip Connections
< Video Processor Unit >
Power Supply, Memory Board, Front Panel, Network and Display Interface
Connector Types Discussed:
Manager of Sales - Industrial
Jeremiah Stanek Technical Marketing Specialist – Industrial