Presenter: Jeremiah Stanek
Webinar Will Cover:
・Achieving high-definition visual images due to increasing demand of high-speed transmission.
・Miniaturizing interconnect technology to achieve minimal invasiveness.
・Heat dissipation to minimize loss of component’s current-carrying capacity.
Applications Include:
< Connections inside the scope >
Processor, Operation Unit, Tip Connections
< Video Processor Unit >
Power Supply, Memory Board, Front Panel, Network and Display Interface
Connector Types Discussed:
・Active Optical Connectors (AOC)
・BNC Type Coaxial Connector
・FunctionMax Floating board-to-board connectors
・EnerBee wire-to-board and wire-to-wire connectors
![Joe Kawada - Manager of Sales - Industrial Joe Kawada - Manager of Sales - Industrial](https://prd-4s-public.s3.ap-northeast-1.amazonaws.com/sys-master/public/h3b/hef/9036454461470/US_Joe-Kawada.jpg)
Joe Kawada
Manager of Sales - Industrial
![Jeremiah Stanek - Technical Marketing Specialist – Industrial Jeremiah Stanek - Technical Marketing Specialist – Industrial](https://prd-4s-public.s3.ap-northeast-1.amazonaws.com/sys-master/public/h4b/h3c/9074361827358/US_Chris-Lattig.jpg)
Jeremiah Stanek Technical Marketing Specialist – Industrial