Technology Advancements in Endoscopes

Offered on 2 dates
October 26th & 28th, 2021 | 1:00 PM Central

Presenter: Jeremiah Stanek

Webinar Will Cover:

・Achieving high-definition visual images due to increasing demand of high-speed transmission.
・Miniaturizing interconnect technology to achieve minimal invasiveness.
・Heat dissipation to minimize loss of component’s current-carrying capacity.

Applications Include:

< Connections inside the scope >
Processor, Operation Unit, Tip Connections
< Video Processor Unit >
Power Supply, Memory Board, Front Panel, Network and Display Interface

Connector Types Discussed:

・Active Optical Connectors (AOC)
・BNC Type Coaxial Connector
・FunctionMax Floating board-to-board connectors
・EnerBee wire-to-board and wire-to-wire connectors

Joe Kawada
Manager of Sales - Industrial

Jeremiah Stanek Technical Marketing Specialist – Industrial