Offered on 2 dates
June 22nd & 24th, 2021 | 1:00 PM Central
Presenter: William MacKillop
Webinar Will Cover:
・Managing the circuit board layout when adding more intelligence and functionality to your system
・Miniaturizing high-speed interconnect with controlled impedance
・Why higher operating temperature affects component specification
・Improving performance in high vibration circuit board applications
Applications Include:
・Mobile robotic vehicles such as AGV/AMR
・SOM, SBC, Main to Sub PCB board-to-board multiple connections
・LiDAR, Radar, HMI, Camera, Sonar, Encoder, and sensitive signals for EMC
・Power distribution modules
Connector Types Discussed:
・FunctionMax Floating board-to-board connectors
・EnerBee Wire-to-board and wire-to-wire connectors
・ix Industrial - New IEC small form factor Ethernet interface
William MacKillop
Interconnect Technology & Technical Support Manager
Joe Kawada
Manager of Sales - Industrial
Chris Lattig
Business Development Manager