High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm  Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin  Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm  Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin  Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High-Speed (25⁺Gbps) BGA Mezzanine Connectors

Hirose’s IT5 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 25⁺ Gbps systems. With the ability to transmit differential, singleended and power through one package and being stackable from 14 to 40 mm, IT5 can solve your interface needs for both current and future generations.

The IT8 mezzanine connector system was developed to enable 56Gbps performance with 
the highest signal density in the market, featuring Quasi-Coaxial Structure and
Polarity-Swap FEXT cancelling technology.
IT8 delivers the most reliable and flexible solution for your current and future needs
to design high speed systems.

Mechanical Features
1. Stacking heights :
-10 to 13mm (Two-piece type)
-14 to 46mm (Three-piece type)
2. No. of Pos. : 120, 192, 288 signals
3. Multiple mounting capability
±0.2mm floating range in X and Y directions
4. Mating alignment : ±1.5mm
5. 1.0×5.5mm BGA interface optimizes routing and SI performance
6. BGA attachment with “Pin in Ball” ensures reliable solder joints with high SMT
processing yields
7. Excellent reflow solderability with superior BGA coplanarity control
8. Compatible with double-sided and inverted reflow soldering

Signal Integrity Features
1. SI capability
-56⁺Gbps (18 to 46mm), 28⁺Gbps (10 to 16mm)
-92ohm impedance (suitable for both 100ohm & 85Ω system)
2. Unique Polarity-Swap FEXT cancelling technology
3. Quasi-Coaxial Structure to prevent noise emission to adjacent lines
4. Insertion loss to Crosstalk Ratio (ICR)