Visit the Hirose Electric team at "CES 2023" to see how Hirose Electric can deliver interconnect solutions to satisfy all of your design requirements.
On display will be a selection of Hirose's user friendly, space saving designs with information on products and technologies for next-generation Wearables, Smart Devices, Automotive, Consumer, IoT, Mobile, and Data Center applications.
About CES 2023
Expo Date |
January 5-8, 2023 |
Location | Venetian Expo Hall C |
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Booth # | #54235 |
Official Site | https://www.ces.tech/ |
Product Highlights
For Consumer Devices
1. Ultra small Board-to-Board/FPC connector with
0.5mm mated height, 0.3mm pitch, 1.5mm depth
2. Supports up to 5A
- Power contact: 5A, Signal contact: 0.3A
3. Fully armored design ensures high robustness
and extraction force
4. Clear tactile click even at a compact size
1. Space-saving Design with 15A Rated Current
2. High Contact Reliability
3. Compact with High Extraction Force
4. Halogen-free
1. Ultra Low Height, Space-saving Design
2. One Action Automatic Locking Design
3. High FPC Retention Force
4. Original FPC Mis-mating Detection Design
1. Compact, Multi-RF capable FPC Connector, World's Smallest Width Class
2. Contact Design Ideal for Both Digital and RF Signal
3. Superior RF Signal Transmission
4. Double Shield Enhances EMI Prevention
For Automotive
1. Space-saving (0.5 size terminal, 2mm pitch)
2. High Heat Resistance : up to 125℃
3. High Vibration Resistance
4. Rated Current : 5A (Mono-Pole Power Supply/ 2A (All-Pole Power Supply)
1. Vibration Resistance
2. Heat Resistance up to 140℃
3. Board Misalignment Absorption
- X and Y Directions : ±0.7mm Floating Range
- Z Direction : ±0.75mm Effective Mating Length
4. Contact Pitch : 1mm