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0.4mm间距 1.5mm高 完全锁扣＆屏蔽型 基板对基板／基板对FPC用连接器
0.4mm Pitch, 3.38mm Depth, 125ºC Heat Resistance, Board-to-Board/FPC-to-Board Connector for Automotive 【DF40T/DF40GT】
1. Space-saving Design and Wide Variations 2. 125℃ Heat Resistant Contact Design 3. World Longest Class Effective Mating Length 4. Guide Ribs for Wide Self Alignment Range 5. Satisfies PCI Express 4.0 (16Gbps) 6. Metal Shielding for Superior EMI 【DF40GT】 7. Reliable Ground Design 【DF40GT】
Small Floating Board-to-Board Connector, 125ºC Heat Resistance for Automotive 【DF40F】
1. 0.4mm Pitch, 3.68mm Width,Stacking Height 3.5 to 6.0mm World' s Smallest Width Classin Floating Board-to-Board Connectors 2. Absorption of Misalignment 3. Wide Variety of Stacking Heights by Mating Combination with DF40T 4. 125℃ Heat Resistance for Automotive Specifications 5. Supports High Speed Transmission
PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors
1. Pitch : 0.8mm 2. Variations : Right Angle / Parallel / Coplanar 3. Stacking Height : 7/9/10/12mm 4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos. 5. Large Guide for Easy Mating 6. Unique Contact Design for Smooth Mating 7. Samtec “Edge Rate®” Licensed Second Source
对应高速传输 0.8mm间距板对板连接器
1. 0.8mm间距 2. 连接方式：共面/垂直/平行（高度：10-45mm） 3. 芯数：40/60/80/100/120/140/160/180 4. MF端子，可用于多种用途 5. 有效嵌合长度2mm（信号端子） 6. 固定于基板的连接器两侧的Dip端子可增强上下・左右耐扭曲力。 7. 导向设计便于嵌合
1. Pitch: 0.5mm 2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle 3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power 4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm 5. Supports PCle Gen.4 (16Gbps) 6. Hybrid Power Design (3A/pin×4 lines) 7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin 8. Pick & Place (suction tape attached as standard) 9. Large guide post for excellent mating performance
[FunctionMAX™]140℃ Heat and Vibration Resistant Board-to-Board Floating Connector1. Vibration Resistance2. Board Misalignment Absorption ・X and Y Directions : ±0.7mm Floating Range ・Z Direction : ±0.75mm Effective Mating Length4. Contact Pitch : 1mm5. Connection Type : Stacking Height : 15mm/18mm/20mm/23mm/25mm6. Pin Count Variations : 20/30/40/50/607. Rated Current : 0.5A/pin8. Pick and Place Mounting9. Excellent mating performance with large guide post
13 to 25A Compatible, Position Misalignment Absorption Type Power Supply Connector for PCB Connections
1. Contact Pitch: 3.81mm, 7.62mm 2. Current Capacity: 13-25A/pin 3. Connection Type: Parallel, Coplanar, Right Angle 4. No. of Pos.: 2 / 3 / 4 / 5pos. 5. Position Misalignment Absorption Range:±0.3 mm 6. Effective Mating Length: 2mm 7. Multi-point Contact Design 8. Low Insertion / Extraction Force 9. Robustness 10. Large Guide For Superior Mating Ability 11. Protected mating face design 12. UL, C-UL and TÜV certified.
1.支持高速传输 (对应56+Gbps NRZ / 112+Gbps PAM4)
2.OAM标准连接器
3.多芯高密度设计 : 688芯 (172DPs/in2)
4.雌雄同体設計、无短线柱双触点构造
5.外壳保护端子前端，防止嵌合时弯曲
6.MOLEX公司「Mirror Mezz」许可的第二供应商
BGA Mezzanine Connector Supporting 10⁺Gbps 1. Original 3 piece design 2. Stacking Height: 17-42mm 3. Staggered1.5mm×1.75mmball grid array 4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds) 5. Differential, single-ended and power 6. Low mating/extracting forces for easy operability 7. Wide mating misalignment tolerances for multiple connector use 8. Can be used to provide high current when used with IT-P
支持高速传输（25⁺Gbps）BGA Mezzanine连接器 广濑IT5转接连接器系统可对应于未来的25+ Gbps系统应用要求以及当今PCIe以及XAUI需求的数据传输速率. 因为它的差分单端传输能力，以及整体的通过电流以及多样化的装配高度14-40mm, IT5可同时解决接口对电流以及未来更新换代的需求
高速传输 BGA夹层连接器 【2片式】 1. 可对应高达28⁺Gbps的高速差分信号 2. 对应85/100Ω两种阻抗设计 3. 实装可靠性高的BGA构造“Pin in Ball” 4. 叠装高度：10,11,12,13mm 5. 允许多个实装构造±0.2mm（X,Y方向） 【3片式】 1. 可对应高达56⁺Gbps的高速差分信号 2. 对应85/100Ω两种阻抗设计 3. 实装可靠性高的BGA构造“Pin in Ball” 4. 叠装高度：14～46mm 5. 允许多个实装构造±0.2mm（X,Y方向）
对应60A/40A 基板间大电流电源连接器
1. 每个引脚40A/60A 2. 3件式结构 3. 自调整大幅度浮动公差 (±0.3mm) 4. 10.8/12mm安装间距 5. 高度变化10-66mm 6. 可与高速传输夹层连接器IT3，IT5＆IT7系列混合使用
0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector
1 Wide ±0.8mm floating range in the X and Y directions 2 High speed transmission (8Gbps) 3 Shield and grounding provide EMI protection 4 Wide self-alignment range : ±1.2mm in X and Y directions 5 Power contacts on each side of the connector (3A/Contact × 4 Contacts)
嵌合高度 7.4mm 车载用板对板同轴连接器
1 板对板低背同轴连接器 (嵌合高度 : 7.4mm) 2 满足各种面向车载设备的严格实验条件 3 清晰的锁扣感防止半嵌合 4 极化键可轻松确认安装方向 5 良好的高频特性 - V.S.W.R. : 1.5 以下 (0 to 3GHz) 6 最适合用于无线充电器, 信息娱乐设备, 远程信息处理, 摄像头, 天线等车载应用
9mm/12mm Mated Height RF Board-to-Board/Wire-to-Board Connector for Automotive
1. Low profile RF Connector - Board-to-Board : 9mm Mated Height - Wire-to-Board : 12mm Mated Height 2. Choice of two connection methods improves board design flexibility 3. Mating failure minimized with clear tactile click 4. Excellent high frequency performance - V.S.W.R. : 1.5 Max. (DC to 6GHz) 5. Meets severe automotive requirements 6. Suitable for Automotive applications such as Infotainment, Telematics, Camera and Antenna
0.4mm Pitch, 0.8mm Height, FPC-to-Board Connectors 1. Stacking height : 0.8mm 2. Ultra space-saving design 3. Two point contact system 4. Superior tactile feedback 5. Drop and shock resistant structure 6. User friendly operations 7. No pattern prohibited area
0.3mm Pitch / Stacking Height 0.6mm / Width 1.9mm Low-Profile Hybrid FPC-to-Board Connector Supporting 5A 1 Low-profile design with high power supply capacity - Rated current: 5A for power contact, 0.3A for signal contact - 0.6mm stacking height, 1.9mm width 2 Full armored design prevents housing damage 3 Easy mating operation with wide self alignment range 4 Insert molded header and receptacle design - Solder Wicking Prevention 5 Multi-point soldering enhances PCB peeling strength
[SignalBee™] 2.0mm Pitch, Double-Row Connector (UL/CSA Compliant) 1. Space-saving on Board 2. Wide Varieties 3. Wide Applicable Wire Range
