0.4mm Pitch, 걸합높이 1.5mm, 완전 Lock, 쉴드 타입 Board to Board/Board to FPC 커넥터

0.4mm Pitch, 3.38mm Depth, 125ºC Heat Resistance,
Board-to-Board/FPC-to-Board Connector for Automotive
【DF40T/DF40GT】

1. Space-saving Design and Wide Variations
2. 125℃ Heat Resistant Contact Design
3. World Longest Class Effective Mating Length
4. Guide Ribs for Wide Self Alignment Range
5. Satisfies PCI Express 4.0 (16Gbps)
6. Metal Shielding for Superior EMI 【DF40GT】
7. Reliable Ground Design 【DF40GT】

Small Floating Board-to-Board Connector,
125ºC Heat Resistance for Automotive
【DF40F】

1. 0.4mm Pitch, 3.68mm Width,Stacking Height 3.5 to 6.0mm
　 World' s Smallest Width Classin Floating Board-to-Board Connectors
2. Absorption of Misalignment
3. Wide Variety of Stacking Heights by Mating Combination with DF40T
4. 125℃ Heat Resistance for Automotive Specifications
5. Supports High Speed Transmission

[FunctionMAX™]

PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors

1. Pitch : 0.8mm
2. Variations : Right Angle / Parallel / Coplanar
3. Stacking Height : 7/9/10/12mm
4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos.
5. Large Guide for Easy Mating 
6. Unique Contact Design for Smooth Mating
7. Samtec “Edge Rate®” Licensed Second Source

[FunctionMAX™]

고속 전송 대응, 0.8mm Pitch, Board to Board Connector

1. 0.8mm Pitch
2. 연결 Type : 수평 / 수직 / 평행 (높이:10 ~ 45mm)
3. Pin : 40/60/80/100/120/140/160/180
4. 다양한 용도로 사용 가능한 MF 단자
5. 유효 결합거리 2mm (신호 단자)
6. 커넥터 양쪽의 기판 고정용 딥 단자로 상하좌우뒤틀림을 강화
7. 넓은 Guide 설계로 우수한 결합성

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

[FunctionMAX™]

140℃ Heat and Vibration Resistant Board-to-Board Floating Connector

1. Vibration Resistance

2. Board Misalignment Absorption

　・X and Y Directions : ±0.7mm Floating Range

　・Z Direction : ±0.75mm Effective Mating Length

4. Contact Pitch : 1mm

5. Connection Type : Stacking

　 Height : 15mm/18mm/20mm/23mm/25mm

6. Pin Count Variations : 20/30/40/50/60

7. Rated Current : 0.5A/pin

8. Pick and Place Mounting

9. Excellent mating performance with large guide post

[FunctionMAX™]

13 to 25A Compatible, Position Misalignment Absorption Type
Power Supply Connector for PCB Connections

1. Contact Pitch: 3.81mm, 7.62mm
2. Current Capacity: 13-25A/pin
3. Connection Type: Parallel, Coplanar, Right Angle
4. No. of Pos.: 2 / 3 / 4 / 5pos.
5. Position Misalignment Absorption Range:±0.3 mm
6. Effective Mating Length: 2mm
7. Multi-point Contact Design
8. Low Insertion / Extraction Force
9. Robustness
10. Large Guide For Superior Mating Ability
11. Protected mating face design
12. UL, C-UL and TÜV certified.

Mirror Mezz, High Speed, Low Height, BGA Mezzanine Connector

1  Molex “Mirror Mezz” Licensed Second Source

2  High Speed Transmission (56⁺Gbps NRZ / 112⁺Gbps PAM4)

3  OAM Specified Connector

4  High Pin Count, High Density : 688pos. (172DPs/in2)

5  Hermaphroditic Connector

6  Stub-less 2-point Contact Design

7   Protective Housing that Encapsulates the Contact Tips
     Prevents Warping During Mating

BGA Mezzanine Connector Supporting 10⁺Gbps

1. Original 3 piece design
2. Stacking Height: 17-42mm
3. Staggered1.5mm×1.75mmball grid array
4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds)
5. Differential, single-ended and power
6. Low mating/extracting forces for easy operability
7. Wide mating misalignment tolerances for multiple connector use
8. Can be used to provide high current when used with IT-P

고속전송 대응 (25+Gbps), BGA 실장, 메자닌 커넥터

1. 독자적인 3-Piece 구조
2. 결합높이 14~40mm
3. BGA 실장 : 지그재그 패턴 1.5mm× 1.75mm BGA (Ball Grid Array)
4. 핀수 : 100, 200, 300 (신호) +110% (추가 그라운드)
5. 차동전송, 싱글엔드 전송, 전원
6. 낮은 삽발력으로 결합 조작성 용이
7. 결합 위치차이 허용량을 크게 설계하여 다수 커넥터 사용 가능
8. Pb-free 사양
9. 양호한 Reflow 실장성

고속 전송용 BGA Mezzanine Connector

[2 Pieces Type]
1. 28+Gbps 고속 차동 신호 대응
2. 85 / 100Ω 대응 가능한 임피던스 설계
3. 실현신뢰성이 높은 BGA 구조 “Pin in Ball”
4. Stackign Heigh : 10,11,12,13mm
5. 복수 실장 허용 구조 ± 0.2mm (X, Y 축)

[3 Pieces Type]
1. 56+Gbps고속 차동 신호 대응
2. 85 / 100Ω 대응 가능한 임피던스 설계
3. 실현신뢰성이 높은 BGA 구조 “Pin in Ball”
4. Stackign Heigh : 14 ~ 46mm
5. 복수 실장 허용 구조 ± 0.2mm (X, Y 축)

60A / 40A 대응, 전원용 Board to Board Connector

1. 40A · 60A / 1 Pin
2. 3 Pieces 구조
3. 충분한 Floating량 (± 0.3mm)
4. 10.8 * 12mm Pitch, Pin-THR 실장
5. 높이 Variation 10 ~ 66mm
6. 고속 전송 Mezzanine Connector IT3, IT5 및 IT7 시리즈와 조합 가능

0.5mm Pitch, 21mm Stacking Height,
125℃ Heat Resistant, Floating Board-to-Board Connector

1 Wide ±0.8mm floating range in the X and Y directions
2 High speed transmission (8Gbps)
3 Shield and grounding provide EMI protection
4 Wide self-alignment range : ±1.2mm in X and Y directions
5 Power contacts on each side of the connector (3A/Contact × 4 Contacts) 

7.4mm Mated Height　RF Board-to-Board Connector for Automotive

1 Low Profile RF Board-to-Board connector (Mated height : 7.4mm)
2 Meets severe automotive requirements
3 Mating failure minimized with clear tactile click
4 Easy to check the mounting direction using the polarity key
5 Excellent high frequency performance - V.S.W.R. : 1.5 Max. (0 to 3GHz)
6 Suitable for Automotive applications such as Wireless phone charger, Infotainment, Telematics, Camera and Antenna

9mm/12mm Mated Height RF Board-to-Board/Wire-to-Board Connector for Automotive

1. Low profile RF Connector
　- Board-to-Board : 9mm Mated Height
　- Wire-to-Board : 12mm Mated Height
2. Choice of two connection methods improves board design flexibility
3. Mating failure minimized with clear tactile click
4. Excellent high frequency performance - V.S.W.R. : 1.5 Max. (DC to 6GHz)
5. Meets severe automotive requirements
6. Suitable for Automotive applications such as Infotainment, Telematics, Camera and Antenna

0.4mm Pitch, 0.8mm Height, FPC-to-Board Connectors

1. Stacking height : 0.8mm
2. Ultra space-saving design
3. Two point contact system
4. Superior tactile feedback
5. Drop and shock resistant structure
6. User friendly operations
7. No pattern prohibited area

0.3mm Pitch / Stacking Height 0.6mm / Width 1.9mm
Low-Profile Hybrid FPC-to-Board Connector Supporting 5A

1 Low-profile design with high power supply capacity
 - Rated current: 5A for power contact,
                         0.3A for signal contact
 - 0.6mm stacking height, 1.9mm width
2 Full armored design prevents housing damage
3 Easy mating operation with wide self alignment range
4 Insert molded header and receptacle design - Solder Wicking Prevention
5 Multi-point soldering enhances PCB peeling strength

[SignalBee™]
2.0mm Pitch, Double-Row Connector (UL/CSA Compliant)

1. Space-saving on Board
2. Wide Varieties
3. Wide Applicable Wire Range