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IT18 Series Recommended

COM-HPC® Standard Compatible, Ultra High Density,​ Low Profile, BGA Mezzanine Connector​


Features

COM-HPC® Standard Compatible, Ultra High Density,
Low Profile BGA Mezzanine Connector


1.COM-HPC® Standard Compatible Connector​ (Version with weld tabs)
2.High Speed Transmission:​
    PCIe Gen5(32GT/s), Gen6(64GT/s PAM4), 100Gb Ethernet​ (4×25Gb)
3.Low Profile Design
    Available in 5mm and 10mm stacking heights
4.High Pin Count and Density: 400 positions (0.635mm Pitch)
5.Open Pin-field Layout
    Flexible pin mapping for various system architectures
​​​6.Reliable BGA Termination​
    Pin-in-ball structure ensures high mounting reliability
​7.Officially Licensed COM-HPC® Connector by Samtec

Video list

  • Connector Type
  • Plug, Receptacle
  • Parts
  • Industry Standard
  • Safety Standards
  • Performance Characteristics
  • , ,
  • Transmission Rate
  • 112.0 Gbps
  • Contact Pitch
  • 0.635 mm
  • Mounting Pitch
  • 0.635 mm
  • Tab Width (mm)
  • Applicable FPC Cable Thickness (mm)
  • Mated Height (Min.)
  • 5.0, 10.0 mm
  • Mated Height (Max.)
  • 5.0, 10.0 mm
  • Mated Height (STEP)
  • Number of Positions
  • 400
  • Remarks on Number of Positions
  • Floating Design
  • Floating Range(XY)(mm)
  • Effective Mating Length(Z)(mm)
  • Mating/Unmating Cycles
  • 100
  • Mounting Style
  • BGA
  • Connector Orientation
  • Straight
  • Contact Plating
  • Gold
  • Rated Current
  • 1.2 A
  • Rated Current other
  • 0.25 A
  • Rated Voltage (AC)
  • AC 150.0 V
  • Rated Voltage (AC) other
  • Rated Voltage (DC)
  • Rated Voltage (DC) other
  • Operating Temperature Max.
  • 125 ℃
  • Operating Temperature Min.
  • -55 ℃
  • Connector Type Details

Major Applications/Product Categories

List of Connectors (Specification Sheet, 2D drawings, 3D models, Distributor inventory)

In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information.