0.4mm Pitch, 1.5 to 4.0mm Height, Board-to-Board/FPC-to-Board Connector

1. High Density Mounting
2. Wide Stacking Height Variations
3. High Contact Reliability
4. Robust Design with Shock Absorbing Ribs
5. Wide Self Alignment Range
6. Supports USB4 Gen.2 (20Gbps) transmission
7. Solder Wicking Prevention
8. Mated Design Protects Contacts
9. Compliant with RoHS
10. High-Speed Signal Support, Noise Prevention

0.4mm Pitch/1.5mm Height, Positive Lock, Shielded Board to Board/Board to FPC Connector

[FunctionMAX™]

PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors

1. Pitch : 0.8mm
2. Variations : Right Angle / Parallel / Coplanar
3. Stacking Height : 7/9/10/12mm
4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos.
5. Large Guide for Easy Mating 
6. Unique Contact Design for Smooth Mating
7. Samtec “Edge Rate®” Licensed Second Source

[FunctionMAX™]

High Speed Transmission, 0.8mm Pitch Connectors for PCB Connections

1. 0.8mm pitch
2. Connection type: Coplanar/Right Angle/Parallel (Height: 10 to 45mm)
3. No of Pos.: 40, 60, 80, 100, 120, 140, 160, 180
4. MF (Multi-Functional) contact
5. Effective mating length of 2mm (Signal contact)
6. Resistant to excess mating force
7. Simplified mating with large guides

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm  Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin  Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm  Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin  Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

[FunctionMAX™]

0.4mm Pitch, Small & Floating, Board-to-Board Connector

1. 0.4mm Pitch, Compact, High Pin Count Connector

2. Connection Type: Right Angle Connection

3. Floating Amount: ±0.45mm in the X and Y directions

4. High Speed Transmission: 2.5Gbps

5. Current Capacity: 0.4A/pin

6. Excellent Mating Operation Due to Wide Self-Alignment Guide

7. Effective Fitting Length: 1mm for High Contact Reliability Design

[FunctionMAX™]

0.8mm Pitch Floating Card Edge Connector

1. Contact pitch : 0.8mm
2. Stacking Height : 22mm Min.
3. Pin Varieties : 40/60/80/100/120
4. Floating Range : ±0.6mm Max. in X and Y directions
5. High speed Transmission : 2.5Gbps (PCle-Gen.1)
6. Customizable interposer PCB
7. Current capacity : 0.5A/pin
8. Pick & Place Mounting (suction tape attached as standard)
9. Large guide post for excellent mating performance

0.8mm Pitch, SpeedEdge – High Speed, Card Edge Connector

1 Molex “SpeedEdge” Licensed Second Source
2 25⁺Gbps per differential pair (Supports PCIe Gen.4)
3 Impedance design suitable for both 85Ω and 100Ω systems (92Ω Impedance Target)
4 0.8mm Pitch High Density Mounting

Mirror Mezz, High Speed, Low Height, BGA Mezzanine Connector

1  Molex “Mirror Mezz” Licensed Second Source

2  High Speed Transmission (56⁺Gbps NRZ / 112⁺Gbps PAM4)

3  OAM Specified Connector

4  High Pin Count, High Density : 688pos. (172DPs/in2)

5  Hermaphroditic Connector

6  Stub-less 2-point Contact Design

7   Protective Housing that Encapsulates the Contact Tips
     Prevents Warping During Mating

BGA Mezzanine Connector Supporting 10⁺Gbps

1. Original 3 piece design
2. Stacking Height: 17-42mm
3. Staggered1.5mm×1.75mmball grid array
4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds)
5. Differential, single-ended and power
6. Low mating/extracting forces for easy operability
7. Wide mating misalignment tolerances for multiple connector use
8. Can be used to provide high current when used with IT-P

High-Speed (25⁺Gbps) BGA Mezzanine Connectors

Hirose’s IT5 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 25⁺ Gbps systems. With the ability to transmit differential, singleended and power through one package and being stackable from 14 to 40 mm, IT5 can solve your interface needs for both current and future generations.

The IT8 mezzanine connector system was developed to enable 56Gbps performance with 
the highest signal density in the market, featuring Quasi-Coaxial Structure and
Polarity-Swap FEXT cancelling technology.
IT8 delivers the most reliable and flexible solution for your current and future needs
to design high speed systems.

Mechanical Features
1. Stacking heights :
-10 to 13mm (Two-piece type)
-14 to 46mm (Three-piece type)
2. No. of Pos. : 120, 192, 288 signals
3. Multiple mounting capability
±0.2mm floating range in X and Y directions
4. Mating alignment : ±1.5mm
5. 1.0×5.5mm BGA interface optimizes routing and SI performance
6. BGA attachment with “Pin in Ball” ensures reliable solder joints with high SMT
processing yields
7. Excellent reflow solderability with superior BGA coplanarity control
8. Compatible with double-sided and inverted reflow soldering

Signal Integrity Features
1. SI capability
-56⁺Gbps (18 to 46mm), 28⁺Gbps (10 to 16mm)
-92ohm impedance (suitable for both 100ohm & 85Ω system)
2. Unique Polarity-Swap FEXT cancelling technology
3. Quasi-Coaxial Structure to prevent noise emission to adjacent lines
4. Insertion loss to Crosstalk Ratio (ICR)

0.5mm Pitch High Speed Transmission, Right Angle Connector

1 High Speed Transmission (32⁺Gbps)
2 High Density : 50 Differential Pairs/Inch (224pos.)
3 Floating design enables mounting of multiple components on same board
4 Wide Varieties - No. of Pos.: 84pos., 152pos., 224pos.

0.5mm Pitch, 21mm Stacking Height,
125℃ Heat Resistant, Floating Board-to-Board Connector

1 Wide ±0.8mm floating range in the X and Y directions
2 High speed transmission (8Gbps)
3 Shield and grounding provide EMI protection
4 Wide self-alignment range : ±1.2mm in X and Y directions
5 Power contacts on each side of the connector (3A/Contact × 4 Contacts)

[FunctionMAX™]

15+Gbps 0.5mm pitch Stacking Connectors
Electrical Interface for the OIF 100G Long-Haul DWDM Transmission Module (MSA-100GLH)

1. 0.5mm Pitch
2. Stacking height: 4 to 8mm (2-piece type), 8 to 13mm (3-piece type)
3. OIF MSA-100GLH Electrical Interface
FX10A-168P/S-SV(83) assembly is specified for the OIF 100G Long-Haul DWDM Transmission Module host line card - MSA-100GLH electrical connector.
4. Suited to High-Density Applications
5. Optional Ground Plate: An alternate style without the ground plate is available.