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BM29 Series Recommended

Ultra-Small, Power & Signal Hybrid, Board to Board / FPC to Board with 3A Max.


Features

Ultra-small, power/signal contact design for Board-to-Board/FPC-to-Board providing 3A max current

1. The world smallest size* contributes to size reduction and flexible design of mobile devices. 
    - Pitch: 0.35mm, Depth: 1.5mm, tacking Height: 0.6mm
2. Power contacts combination enables 3A power delivery. Power + signal hybrid type
    - Rated current: 3A for power, 0.3A for signal
3. Unique metal guides prevent the housing damage due to offset mating. (Self-alignment with guide ribs)
4. Secure mating with clear tactile click
5. High contact reliability with 2-point contact design
*:As of January, 2020

Specifications

  • Connector Type
  • Receptacle, Header
  • Parts
  • Industry Standard
  • Safety Standards
  • Performance Characteristics
  • USB3.1
  • Transmission Rate
  • 10.0 Gbps
  • Contact Pitch
  • 0.35 mm
  • Mounting Pitch
  • 0.35 mm
  • Tab Width (mm)
  • Mated Height (Min.)
  • 0.6 mm
  • Mated Height (Max.)
  • 0.6 mm
  • Mated Height (STEP)
  • 0.6 mm
  • Number of Positions
  • 2, 4, 6, 24
  • Remarks on Number of Positions
  • Signal:2 Power:2, Signal:6 Power:2, Signal:24 Power:2, Signal:4 Power:2
  • Floating Design
  • Mating/Unmating Cycles
  • 10
  • Mounting Style
  • SMT
  • Connector Orientation
  • Straight
  • Contact Plating
  • Gold
  • Rated Current
  • 3.0 A
  • Rated Voltage (AC)
  • AC 30.0 V
  • Rated Voltage (DC)
  • DC 30.0 V
  • Operating Temperature Max.
  • 85 ℃
  • Operating Temperature Min.
  • -40 ℃

In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information.