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POK19 Series

9mm/12mm Mated Height RF Board-to-Board/Wire-to-Board Connector for Automotive


Features

9mm/12mm Mated Height RF Board-to-Board/Wire-to-Board Connector for Automotive

1. Low profile RF Connector
 - Board-to-Board : 9mm Mated Height
 - Wire-to-Board : 12mm Mated Height
2. Choice of two connection methods improves board design flexibility
3. Mating failure minimized with clear tactile click
4. Excellent high frequency performance - V.S.W.R. : 1.5 Max. (DC to 6GHz)
5. Meets severe automotive requirements
6. Suitable for Automotive applications such as Infotainment, Telematics, Camera and Antenna

Specifications

  • Connector Type
  • Plug, Receptacle, Plug receptacle
  • Parts
  • Industry Standard
  • Safety Standards
  • Performance Characteristics
  • Transmission Rate
  • Contact Pitch
  • Mounting Pitch
  • Tab Width (mm)
  • Mated Height (Min.)
  • 9.0 mm
  • Mated Height (Max.)
  • 9.0, 12.0 mm
  • Mated Height (STEP)
  • 9.0, 12.0 mm
  • Number of Positions
  • Remarks on Number of Positions
  • Floating Design
  • Mating/Unmating Cycles
  • 30
  • Mounting Style
  • SMT
  • Connector Orientation
  • Straight, Right angle
  • Contact Plating
  • Rated Current
  • Rated Voltage (AC)
  • Rated Voltage (DC)
  • Operating Temperature Max.
  • 105 ℃
  • Operating Temperature Min.
  • -40 ℃
  • Generic Type
  • Water Resistance
  • Cable Assembly
  • Cable Length
  • Characteristic Impedance
  • 50.0 Ω
  • Frequency (Max.)
  • 6.0 GHz
  • V.S.W.R.
  • 1.5 Max.
  • Center Contact Plating
  • Gold
  • Outer Contact Plating
  • Recommended Coaxial Cable
  • Cable Outer Diameter
  • 3.0 mm
  • Wire Termination Method
  • Soldering
  • Max. Wire Insulation Diameter
  • Min. Wire Insulation Diameter
  • Shield Diameter
  • Center Conductor Diameter
  • Notes on Recommended Wire
  • Cable Color
  • Type 1 Mating Face Connector
  • Type 2 Mating Face Connector
  • Return Loss

In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information.