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  • GT8E

    High contact pressure Wire-to-Board connectors

    1.Use of an formed dimple construction at the contact portion, serves to prevent oxidation of the contact portion.
    2.Design prevents mis-insertions.
    3.Stress resisting design.
    4.SMT type pin header with pin-in-hole type metal fittings improves PCB retention. High PCB retention force.

    • Connector Type
    • Parts
    • Cable Assembly
    • Industry Standard
    • Safety Standards
    • Number of Positions
    • Number of Rows (Interface)
    • Mounting Pitch
    • Contact Pitch
    • Connector Length
    • Connector Width
    • Connector Height
    • Mounting Style
    • Mounting Side
    • PCB Stabilizing Feature
    • Staggered Lead
    • Recommended PCB Thickness
    • Connector Orientation
    • Mating/Unmating Cycles
    • 30
    • Contact Plating
    • Plating Thickness
    • 0.2, 1.0 μm
    • Housing Color
    • Wire TerMin.ation Method
    • Recommended Wire Type
    • Recommended Min. Wire Size (AWG)
    • Recommended Max. Wire Size (AWG)
    • Recommended Min. Wire Size (mm²)
    • Recommended Max. Wire Size (mm²)
    • Operating Temperature Max.
    • 105 ℃
    • Operating Temperature Min.
    • -40 ℃
    • Panel Mounting Style