Mirror Mezz, High Speed, Low Height, BGA Mezzanine Connector

1  Molex “Mirror Mezz” Licensed Second Source

2  High Speed Transmission (56⁺Gbps NRZ / 112⁺Gbps PAM4)

3  OAM Specified Connector

4  High Pin Count, High Density:
    404pos. (101 Differential Pairs), 688pos. (172 Differential Pairs)

5  Hermaphroditic Connector

6  Stub-less 2-point Contact Design

7   Protective Housing that Encapsulates the Contact Tips
     Prevents Warping During Mating

COM-HPC^® Standard Compatible, Ultra High Density,
Low Profile BGA Mezzanine Connector

1．COM-HPC^® Standard Compatible Connector​ (Version with weld tabs)
2．High Speed Transmission:​
　   PCIe Gen5(32GT/s), Gen6(64GT/s PAM4), 100Gb Ethernet​ (4×25Gb)
3．Low Profile Design
　   Available in 5mm and 10mm stacking heights
4．High Pin Count and Density: 400 positions (0.635mm Pitch)
5．Open Pin-field Layout
　   Flexible pin mapping for various system architectures
​​​6．Reliable BGA Termination​
　   Pin-in-ball structure ensures high mounting reliability
​7．Officially Licensed COM-HPC^® Connector by Samtec