Mirror Mezz, High Speed, Low Height, BGA Mezzanine Connector

1  Molex “Mirror Mezz” Licensed Second Source

2  High Speed Transmission (56⁺Gbps NRZ / 112⁺Gbps PAM4)

3  OAM Specified Connector

4  High Pin Count, High Density:
    404pos. (101 Differential Pairs), 688pos. (172 Differential Pairs)

5  Hermaphroditic Connector

6  Stub-less 2-point Contact Design

7   Protective Housing that Encapsulates the Contact Tips
     Prevents Warping During Mating

COM-HPC^® Standard Compatible, Ultra High Density,
Low Profile BGA Mezzanine Connector

1．COM-HPC^® Standard Compatible Connector​ (Version with weld tabs)
2．High Speed Transmission:​
　   PCIe Gen5(32GT/s), Gen6(64GT/s PAM4), 100Gb Ethernet​ (4×25Gb)
3．Low Profile Design
　   Available in 5mm and 10mm stacking heights
4．High Pin Count and Density: 400 positions (0.635mm Pitch)
5．Open Pin-field Layout
　   Flexible pin mapping for various system architectures
​​​6．Reliable BGA Termination​
　   Pin-in-ball structure ensures high mounting reliability
​7．Officially Licensed COM-HPC^® Connector by Samtec

High-Speed (25⁺Gbps) BGA Mezzanine Connectors

Hirose’s IT5 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 25⁺ Gbps systems. With the ability to transmit differential, singleended and power through one package and being stackable from 14 to 40 mm, IT5 can solve your interface needs for both current and future generations.

High-Speed 56Gbps BGA Mezzanine Connectors

[Mechanical Features]

1. Stacking Heights
 Two-piece Type: 10 to 13mm

 Three-piece Type: 14 to 46mm
2. Available with 120, 192, or 288 signal contacts.
3. Multiple Mating Capability
4. Mating Alignment : +/-1.5mm
5. “Pin in Ball” BGA Attachment
6. Compatible with Doublesided and Inverted Reflow Soldering
7. 1.0mm BGA Row Pitch for High Signal Density

[Signal Integrity Features]
8. SI Capability
9. Unique Polarity-Swap FEXT Cancelling Technology

10. Quasi-Coaxial Design