[FunctionMAX™]

PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors

1. Pitch : 0.8mm
2. Variations : Right Angle / Parallel / Coplanar
3. Stacking Height : 7/9/10/12mm
4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos.
5. Large Guide for Easy Mating 
6. Unique Contact Design for Smooth Mating
7. Samtec “Edge Rate®” Licensed Second Source

[FunctionMAX™]

High Speed Transmission, 0.8mm Pitch Connectors for PCB Connections

1. 0.8mm pitch
2. Connection type: Coplanar/Right Angle/Parallel (Height: 10 to 45mm)
3. No of Pos.: 40, 60, 80, 100, 120, 140, 160, 180
4. MF (Multi-Functional) contact
5. Effective mating length of 2mm (Signal contact)
6. Resistant to excess mating force
7. Simplified mating with large guides

FX18H
0.8mm Pitch, Open Pluggable Specification (OPS) Compliant 
125℃ Heat-Resistant, Board-to-Board Horizontal Connection Connector

1   Open Pluggable Specification (OPS) Compliant
     OPS is an Intel specification that serves as the industry-wide standard for digital signage, etc.  
2   High-Speed Variation of the FX18 Series
　 Enhancing high-speed performance by optimized contact shapes and configurations of the conventional FX18 Series.
3   125℃ Heat Resistance
4   Compatible Mating and Mounting Pattern with the FX18 Series

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm  Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin  Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm  Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin  Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

Mirror Mezz, High Speed, Low Height, BGA Mezzanine Connector

1  Molex “Mirror Mezz” Licensed Second Source

2  High Speed Transmission (56⁺Gbps NRZ / 112⁺Gbps PAM4)

3  OAM Specified Connector

4  High Pin Count, High Density : 688pos. (172DPs/in2)

5  Hermaphroditic Connector

6  Stub-less 2-point Contact Design

7   Protective Housing that Encapsulates the Contact Tips
     Prevents Warping During Mating

BGA Mezzanine Connector Supporting 10⁺Gbps

1. Original 3 piece design
2. Stacking Height: 17-42mm
3. Staggered1.5mm×1.75mmball grid array
4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds)
5. Differential, single-ended and power
6. Low mating/extracting forces for easy operability
7. Wide mating misalignment tolerances for multiple connector use
8. Can be used to provide high current when used with IT-P

High-Speed (25⁺Gbps) BGA Mezzanine Connectors

Hirose’s IT5 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 25⁺ Gbps systems. With the ability to transmit differential, singleended and power through one package and being stackable from 14 to 40 mm, IT5 can solve your interface needs for both current and future generations.

High-Speed 56Gbps BGA Mezzanine Connectors

[Mechanical Features]

1. Stacking Heights
 Two-piece Type: 10 to 13mm

 Three-piece Type: 14 to 46mm
2. Available with 120, 192, or 288 signal contacts.
3. Multiple Mating Capability
4. Mating Alignment : +/-1.5mm
5. “Pin in Ball” BGA Attachment
6. Compatible with Doublesided and Inverted Reflow Soldering
7. 1.0mm BGA Row Pitch for High Signal Density

[Signal Integrity Features]
8. SI Capability
9. Unique Polarity-Swap FEXT Cancelling Technology

10. Quasi-Coaxial Design

0.5mm Pitch, High Speed Transmission, Right Angle Connector

1  High Speed Transmission (32Gbps)
2  Floating design enables mounting of multiple components on same board
3  Varieties, No. of Pos.: 152pos.

[FunctionMAX™]

15+Gbps 0.5mm pitch Stacking Connectors
Electrical Interface for the OIF 100G Long-Haul DWDM Transmission Module (MSA-100GLH)

1. 0.5mm Pitch
2. Stacking height: 4 to 8mm (2-piece type), 8 to 13mm (3-piece type)
3. OIF MSA-100GLH Electrical Interface
FX10A-168P/S-SV(83) assembly is specified for the OIF 100G Long-Haul DWDM Transmission Module host line card - MSA-100GLH electrical connector.
4. Suited to High-Density Applications
5. Optional Ground Plate: An alternate style without the ground plate is available.