0.4mm间距 1.5mm高 完全锁扣＆屏蔽型 基板对基板／基板对FPC用连接器

0.4mm间距，3.38mm深度，125oC耐热，
用于汽车的Board to Board/FPC to Board连接器
【DF40T/DF40GT】

1.节省空间的设计和广泛的变化
2.125°C耐热触头设计
3.世界最长等级有效交配长度
4.宽自调整范围的指南肋骨
5.满足PCI-前4 (16Gbps)
6.用于高级EMI的金属屏蔽 【DF40GT】
7.可靠的地面设计 【DF40GT】

汽车用小型浮板转板连接器，125oC热阻
【DF40F】
1. 0.4毫米间距，3.68毫米宽度，堆叠高度3.5至6.0毫米世界上最小宽度级别的浮动船板到船舱连接器。
2. 吸收错位。
3. 与DF40T配型组合堆垛高度的多样性。
4. 125°C耐热汽车规格。
5. 支持高速传输。

[FunctionMAX™]

PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors

1. Pitch : 0.8mm
2. Variations : Right Angle / Parallel / Coplanar
3. Stacking Height : 7/9/10/12mm
4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos.
5. Large Guide for Easy Mating 
6. Unique Contact Design for Smooth Mating
7. Samtec “Edge Rate®” Licensed Second Source

[FunctionMAX™]

对应高速传输 0.8mm间距板对板连接器

1. 0.8mm间距
2. 连接方式：共面/垂直/平行（高度：10-45mm）
3. 芯数：40/60/80/100/120/140/160/180
4. MF端子，可用于多种用途
5. 有效嵌合长度2mm（信号端子）
6. 固定于基板的连接器两侧的Dip端子可增强上下・左右耐扭曲力。
7. 导向设计便于嵌合
 

FX18H
0.8mm 间距、支持开放式可插拔规范（OPS=Open Pluggable Specification）
支持125℃、水平连接板对板连接器

1  支持开放式可插拔规范（OPS）
    OPS是英特尔制定的数字标牌等备开放标准
2  通过改变现有FX18系列的端子形状等，改善了高速特性
3  支持125℃耐高温
4  可与FX18系列互插，基板焊盘通用

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

[FunctionMAX™]
140℃ Heat and Vibration Resistant Board-to-Board Floating Connector
1. Vibration Resistance
2. Heat Resistance up to 140℃
3. Board Misalignment Absorption
　・X and Y Directions : ±0.7mm Floating Range
　・Z Direction : ±0.75mm Effective Mating Length
4. Contact Pitch : 1mm
5. Connection Type : Stacking
　 Height : 15mm/18mm/20mm/23mm/25mm
6. Pin Count Variations : 20/30/40/50/60
7. Rated Current : 0.5A/pin
8. Pick and Place Mounting
9. Excellent mating performance with large guide post

Received "CES 2020 Innovation Awards" in Vehicle Intelligence & Transportation category. 

[FunctionMAX™]

13 to 25A Compatible, Position Misalignment Absorption Type
Power Supply Connector for PCB Connections

1. Contact Pitch: 3.81mm, 7.62mm
2. Current Capacity: 13-25A/pin
3. Connection Type: Parallel, Coplanar, Right Angle
4. No. of Pos.: 2 / 3 / 4 / 5pos.
5. Position Misalignment Absorption Range:±0.3 mm
6. Effective Mating Length: 2mm
7. Multi-point Contact Design
8. Low Insertion / Extraction Force
9. Robustness
10. Large Guide For Superior Mating Ability
11. Protected mating face design
12. UL, C-UL and TÜV certified.

1.支持高速传输 (对应56+Gbps NRZ / 112+Gbps PAM4)

2.OAM标准连接器

3.多芯高密度设计 : 688芯 (172DPs/in2)

4.雌雄同体設計、无短线柱双触点构造

5.外壳保护端子前端，防止嵌合时弯曲

6.MOLEX公司「Mirror Mezz」许可的第二供应商

BGA Mezzanine Connector Supporting 10⁺Gbps

1. Original 3 piece design
2. Stacking Height: 17-42mm
3. Staggered1.5mm×1.75mmball grid array
4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds)
5. Differential, single-ended and power
6. Low mating/extracting forces for easy operability
7. Wide mating misalignment tolerances for multiple connector use
8. Can be used to provide high current when used with IT-P

支持高速传输（25⁺Gbps）BGA Mezzanine连接器

广濑IT5转接连接器系统可对应于未来的25+ Gbps系统应用要求以及当今PCIe以及XAUI需求的数据传输速率. 因为它的差分单端传输能力，以及整体的通过电流以及多样化的装配高度14-40mm, IT5可同时解决接口对电流以及未来更新换代的需求

高速56GbpsBGA夹层连接器

[机械特性]

1.堆叠高度
 两片式:10到13毫米

 三片式:14到46毫米
2.可配有120,192或288个信号触点。
3.多项匹配能力
4.交配对齐:+/-1.5mm
5.“Pin in Ball”BGA附件
6.双面倒流焊接兼容
7.1.0mm BGA行距实现高信号密度

【信号完整性功能】
8.SI能力
9.独特的极性交换FEXT消除技术

10.准同轴设计

60A/70A额定电流，船到船电源引脚连接器

1.每针电流额定60/70A
2.堆叠高度变化:10到66毫米
3.3件设计
4.间距:10.8毫米和12毫米孔内的针膏 (PIH)
5.适用于高速传动夹层连接器IT3、IT5和IT8。

0.5mm Pitch, 21mm Stacking Height,
125℃ Heat Resistant, Floating Board-to-Board Connector

1 Wide ±0.8mm floating range in the X and Y directions
2 High speed transmission (8Gbps)
3 Shield and grounding provide EMI protection
4 Wide self-alignment range : ±1.2mm in X and Y directions
5 Power contacts on each side of the connector (3A/Contact × 4 Contacts)

嵌合高度 7.4mm　车载用板对板同轴连接器

1 板对板低背同轴连接器 (嵌合高度 : 7.4mm)
2 满足各种面向车载设备的严格实验条件
3 清晰的锁扣感防止半嵌合
4 极化键可轻松确认安装方向
5 良好的高频特性 - V.S.W.R. : 1.5 以下 (0 to 3GHz)
6 最适合用于无线充电器, 信息娱乐设备, 远程信息处理, 摄像头, 天线等车载应用

9mm/12mm Mated Height RF Board-to-Board/Wire-to-Board Connector for Automotive

1. Low profile RF Connector
　- Board-to-Board : 9mm Mated Height
　- Wire-to-Board : 12mm Mated Height
2. Choice of two connection methods improves board design flexibility
3. Mating failure minimized with clear tactile click
4. Excellent high frequency performance - V.S.W.R. : 1.5 Max. (DC to 6GHz)
5. Meets severe automotive requirements
6. Suitable for Automotive applications such as Infotainment, Telematics, Camera and Antenna

0.4mm Pitch, 0.8mm Height, FPC-to-Board Connectors

1. Stacking height : 0.8mm
2. Ultra space-saving design
3. Two point contact system
4. Superior tactile feedback
5. Drop and shock resistant structure
6. User friendly operations
7. No pattern prohibited area

[SignalBee™]
2.0mm Pitch, Double-Row Connector (UL/CSA Compliant)

1. Space-saving on Board
2. Wide Varieties
3. Wide Applicable Wire Range