Small Floating Board-to-Board Connector,
125ºC Heat Resistance, For Automotive Applications

1. Stacking Height 3.0 to 4.5mm, Floating Range ±0.4mm, World's Smallest Width Class in Floating Board-to-Board Connectors

2. Absorption of Misalignment

3. 125℃ Heat Resistance for Automotive Specifications

4. High Contact Reliability with Two- Point Contact

5. Supports PCI-ex Gen4 (16Gbps) and MIPI D-PHY Ver. 2.1

Small Floating Board-to-Board Connector,
125ºC Heat Resistance for Automotive
【DF40F】

1. 0.4mm Pitch, 3.68mm Width,Stacking Height 3.5 to 6.0mm
　 World' s Smallest Width Class in Floating Board-to-Board Connectors
2. Absorption of Misalignment
3. Wide Variety of Stacking Heights by Mating Combination with DF40T
4. 125℃ Heat Resistance for Automotive Specifications
5. Supports High Speed Transmission

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

[FunctionMAX™]

0.4mm Pitch, Small & Floating, Board-to-Board Connector

1. 0.4mm Pitch, Compact, High Pin Count Connector

2. Connection Type: Right Angle Connection

3. Floating Amount: ±0.45mm in the X and Y directions

4. High Speed Transmission: 2.5Gbps

5. Current Capacity: 0.4A/pin

6. Excellent Mating Operation Due to Wide Self-Alignment Guide

7. Effective Fitting Length: 1mm for High Contact Reliability Design

[FunctionMAX™]
140℃ Heat and Vibration Resistant Board-to-Board Floating Connector
1. Vibration Resistance
2. Heat Resistance up to 140℃
3. Board Misalignment Absorption
　・X and Y Directions : ±0.7mm Floating Range
　・Z Direction : ±0.75mm Effective Mating Length
4. Contact Pitch : 1mm
5. Connection Type : Stacking
　 Height : 15mm/18mm/20mm/23mm/25mm
6. Pin Count Variations : 20/30/40/50/60
7. Rated Current : 0.5A/pin
8. Pick and Place Mounting
9. Excellent mating performance with large guide post

Received "CES 2020 Innovation Awards" in Vehicle Intelligence & Transportation category. 

[FunctionMAX™]

13 to 25A Compatible, Position Misalignment Absorption Type
Power Supply Connector for PCB Connections

1. Contact Pitch: 3.81mm, 7.62mm
2. Current Capacity: 13-25A/pin
3. Connection Type: Parallel, Coplanar, Right Angle
4. No. of Pos.: 2 / 3 / 4 / 5pos.
5. Position Misalignment Absorption Range:±0.3 mm
6. Effective Mating Length: 2mm
7. Multi-point Contact Design
8. Low Insertion / Extraction Force
9. Robustness
10. Large Guide For Superior Mating Ability
11. Protected mating face design
12. UL, C-UL and TÜV certified.

BGA Mezzanine Connector Supporting 10⁺Gbps

1. Original 3 piece design
2. Stacking Height: 17-42mm
3. Staggered1.5mm×1.75mmball grid array
4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds)
5. Differential, single-ended and power
6. Low mating/extracting forces for easy operability
7. Wide mating misalignment tolerances for multiple connector use
8. Can be used to provide high current when used with IT-P

Высокоскоростной (25⁺Gbps) мезонинный разъём до 300 контактов. Технология пайки BGA (Ball-Grid Array)

Соединительная система мезонинных разъёмов серии IT5 может использоваться как для передачи данных по протоколу PCIe и XAUI, так и в оборудовании, где передача данных превышает 25 Gbps.
Через разъём возможна передача дифференциальных (100 Ом) и одиночных линий (50 Ом) сигналов, а также силовых линий питания. Высота варьируется в диапазоне от 14 до 40 мм.
IT5 серия может помочь вам решить задачи с интерфейсом для нынешних и будущих поколений высокоскоростного оборудования

High-Speed 56Gbps BGA Mezzanine Connectors

[Mechanical Features]

1. Stacking Heights
 Two-piece Type: 10 to 13mm

 Three-piece Type: 14 to 46mm
2. Available with 120, 192, or 288 signal contacts.
3. Multiple Mating Capability
4. Mating Alignment : +/-1.5mm
5. “Pin in Ball” BGA Attachment
6. Compatible with Doublesided and Inverted Reflow Soldering
7. 1.0mm BGA Row Pitch for High Signal Density

[Signal Integrity Features]
8. SI Capability
9. Unique Polarity-Swap FEXT Cancelling Technology

10. Quasi-Coaxial Design

0.5mm Pitch High Speed Transmission, Right Angle Connector

1 High Speed Transmission (32⁺Gbps)
2 High Density : 50 Differential Pairs/Inch (224pos.)
3 Floating design enables mounting of multiple components on same board
4 Wide Varieties - No. of Pos.: 84pos., 152pos., 224pos.

Horizontal Type, Monopole Floating Board-to-Board Connector

1.Slim & low-profile

2.Long Effective Mating Length: 1.3mm

3.Floating design

4.Clear tactile click

5.High current capability: 3A

0.5mm Pitch, 21mm Stacking Height,
125℃ Heat Resistant, Floating Board-to-Board Connector

1 Wide ±0.8mm floating range in the X and Y directions
2 High speed transmission (8Gbps)
3 Shield and grounding provide EMI protection
4 Wide self-alignment range : ±1.2mm in X and Y directions
5 Power contacts on each side of the connector (3A/Contact × 4 Contacts)

[SnapBee™]

2mm Pitch, Multi functional Connector System. (UL and CSA certified)
(Floating [Board-to-Board], Swing-Lock [Wire-to-Board], Short Pin)

1. High Operating Temperature
2. Swing Lock Structure (Wire-to-Board)
3. Short-Circuit Pin Connector
4. Multi Function Design
5. Contact Design
6. Common Applicator
7. Floating Structure (Board-to-Board)
8. Space Savings
9. Robust locking structure on DF59M (W-to-B Connection)
10. Standardization of PCB layout

[FunctionMAX™]

Разъёмы типа плата-плата с шагом 0,5 мм для высокоскоростных сигналов больше 15 Gbps
С этими разъёмами разработан электрический интерфейс для дальнемагистральных модульей передачи данных OIF 100G Long-Haul DWDM

[FunctionMAX™]

Разъём типа плата-плата с плавающей конструкцией, двойным контактом и шагом 0,5 мм

[FunctionMAX™]

Разъёмы плата-плата с плавающей конструкцией и шагом 0,5 мм