0.35mm Pitch, 2.2mm Depth, 0.6mm Stacking Height, High-Frequency, High-Speed,
Shielded, Power/Signal Hybrid FPC-to-Board Connector

1. High Power Supply Capacity and Space-saving Design
2. Excellent EMI Prevention with Fully Shielded Design
3. Supports High Speed Transmission (up to 40Gbps)
4. Superior RF Signal Transmission up to 40GHz
5. Robust and Durable Fully Armored Design

Small Floating Board-to-Board Connector,
125ºC Heat Resistance, For Automotive Applications

1. Stacking Height 3.0 to 4.5mm, Floating Range ±0.4mm, World's Smallest Width Class in Floating Board-to-Board Connectors

2. Absorption of Misalignment

3. 125℃ Heat Resistance for Automotive Specifications

4. High Contact Reliability with Two- Point Contact

5. Supports PCI-ex Gen4 (16Gbps) and MIPI D-PHY Ver. 2.1

0.4mm Pitch, 1.5 to 4.0mm Height, Board-to-Board/FPC-to-Board Connector

1. High Density Mounting
2. Wide Stacking Height Variations
3. High Contact Reliability
4. Robust Design with Shock Absorbing Ribs
5. Wide Self Alignment Range
6. Supports USB4 Gen.2 (20Gbps) transmission
7. Solder Wicking Prevention
8. Mated Design Protects Contacts
9. Compliant with RoHS
10. High-Speed Signal Support, Noise Prevention

Small Floating Board-to-Board Connector,
125ºC Heat Resistance for Automotive
【DF40F】

1. 0.4mm Pitch, 3.68mm Width,Stacking Height 3.5 to 6.0mm
　 World' s Smallest Width Classin Floating Board-to-Board Connectors
2. Absorption of Misalignment
3. Wide Variety of Stacking Heights by Mating Combination with DF40T
4. 125℃ Heat Resistance for Automotive Specifications
5. Supports High Speed Transmission

Экранированный разъем «плата - плата» / «плата - гибкая печатная плата» с замком с фиксатором, с шагом 0,4 мм / высотой 1,5 мм

0.4mm Pitch, 3.38mm Depth, 125ºC Heat Resistance,
Board-to-Board/FPC-to-Board Connector for Automotive
【DF40T/DF40GT】

1. Space-saving Design and Wide Variations
2. 125℃ Heat Resistant Contact Design
3. World Longest Class Effective Mating Length
4. Guide Ribs for Wide Self Alignment Range
5. Satisfies PCI Express 4.0 (16Gbps)
6. Metal Shielding for Superior EMI 【DF40GT】
7. Reliable Ground Design 【DF40GT】

Small Floating Board-to-Board Connector,
125ºC Heat Resistance for Automotive
【DF40F】

1. 0.4mm Pitch, 3.68mm Width,Stacking Height 3.5 to 6.0mm
　 World' s Smallest Width Classin Floating Board-to-Board Connectors
2. Absorption of Misalignment
3. Wide Variety of Stacking Heights by Mating Combination with DF40T
4. 125℃ Heat Resistance for Automotive Specifications
5. Supports High Speed Transmission

[FunctionMAX™]

PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors

1. Pitch : 0.8mm
2. Variations : Right Angle / Parallel / Coplanar
3. Stacking Height : 7/9/10/12mm
4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos.
5. Large Guide for Easy Mating 
6. Unique Contact Design for Smooth Mating
7. Samtec “Edge Rate®” Licensed Second Source

[FunctionMAX™]

Гибридный разъём типа плата-плата с шагом 0,8 мм. Сигнальные контакты на 10+ Gbps, 4 силовых контакта по 3 А каждый

1. Шаг 0,8 мм
2. Варианты соеденения: горизонтальный / вертикальный / паралельный
3. Количество контактов: 40/60/80/100/120/140
4. Мультифункциональный силовой контакт (MF контакт):
- может использоваться как дополнительний контакт заземления,
- контакт питания до 12 А (имеется 4 контакта по 3 А на контакт),
- 3x-ступенчатая поочерёдность последовательности коммутации (для заземления и сигнала обнаружения).
5. Эффективная длина коммутационной площадки контакта, сигнальные контакты: 2,0 мм, MF контакт A: 2,5 мм , MF контакт B: 1,5 мм
6. MF контакты имеют сквозные выводы для увеличения механической прочности поверхностного монтажа.
7. Направляющие обеcпечивают лёгкое сочленение.

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

0.8mm Pitch, SpeedEdge – High Speed, Card Edge Connector

1 Molex “SpeedEdge” Licensed Second Source
2 25⁺Gbps per differential pair (Supports PCIe Gen.4)
3 Impedance design suitable for both 85Ω and 100Ω systems (92Ω Impedance Target)
4 0.8mm Pitch High Density Mounting

Mirror Mezz, High Speed, Low Height, BGA Mezzanine Connector

1  Molex “Mirror Mezz” Licensed Second Source

2  High Speed Transmission (56⁺Gbps NRZ / 112⁺Gbps PAM4)

3  OAM Specified Connector

4  High Pin Count, High Density : 688pos. (172DPs/in2)

5  Hermaphroditic Connector

6  Stub-less 2-point Contact Design

7   Protective Housing that Encapsulates the Contact Tips
     Prevents Warping During Mating

BGA Mezzanine Connector Supporting 10⁺Gbps

1. Original 3 piece design
2. Stacking Height: 17-42mm
3. Staggered1.5mm×1.75mmball grid array
4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds)
5. Differential, single-ended and power
6. Low mating/extracting forces for easy operability
7. Wide mating misalignment tolerances for multiple connector use
8. Can be used to provide high current when used with IT-P

Высокоскоростной (25⁺Gbps) мезонинный разъём до 300 контактов. Технология пайки BGA (Ball-Grid Array)

Соединительная система мезонинных разъёмов серии IT5 может использоваться как для передачи данных по протоколу PCIe и XAUI, так и в оборудовании, где передача данных превышает 25 Gbps.
Через разъём возможна передача дифференциальных (100 Ом) и одиночных линий (50 Ом) сигналов, а также силовых линий питания. Высота варьируется в диапазоне от 14 до 40 мм.
IT5 серия может помочь вам решить задачи с интерфейсом для нынешних и будущих поколений высокоскоростного оборудования

The IT8 mezzanine connector system was developed to enable 56Gbps performance with 
the highest signal density in the market, featuring Quasi-Coaxial Structure and
Polarity-Swap FEXT cancelling technology.
IT8 delivers the most reliable and flexible solution for your current and future needs
to design high speed systems.

Mechanical Features
1. Stacking heights :
-10 to 13mm (Two-piece type)
-14 to 46mm (Three-piece type)
2. No. of Pos. : 120, 192, 288 signals
3. Multiple mounting capability
±0.2mm floating range in X and Y directions
4. Mating alignment : ±1.5mm
5. 1.0×5.5mm BGA interface optimizes routing and SI performance
6. BGA attachment with “Pin in Ball” ensures reliable solder joints with high SMT
processing yields
7. Excellent reflow solderability with superior BGA coplanarity control
8. Compatible with double-sided and inverted reflow soldering

Signal Integrity Features
1. SI capability
-56⁺Gbps (18 to 46mm), 28⁺Gbps (10 to 16mm)
-92ohm impedance (suitable for both 100ohm & 85Ω system)
2. Unique Polarity-Swap FEXT cancelling technology
3. Quasi-Coaxial Structure to prevent noise emission to adjacent lines
4. Insertion loss to Crosstalk Ratio (ICR)

0.5mm Pitch High Speed Transmission, Right Angle Connector

1 High Speed Transmission (32⁺Gbps)
2 High Density : 50 Differential Pairs/Inch (224pos.)
3 Floating design enables mounting of multiple components on same board
4 Wide Varieties - No. of Pos.: 84pos., 152pos., 224pos.

0.5mm Pitch, 21mm Stacking Height,
125℃ Heat Resistant, Floating Board-to-Board Connector

1 Wide ±0.8mm floating range in the X and Y directions
2 High speed transmission (8Gbps)
3 Shield and grounding provide EMI protection
4 Wide self-alignment range : ±1.2mm in X and Y directions
5 Power contacts on each side of the connector (3A/Contact × 4 Contacts)

[FunctionMAX™]

Разъёмы типа плата-плата с шагом 0,5 мм для высокоскоростных сигналов больше 15 Gbps
С этими разъёмами разработан электрический интерфейс для дальнемагистральных модульей передачи данных OIF 100G Long-Haul DWDM

[FunctionMAX™]

Высокоскоростной разъём типа плата-плата с шагом 0,5 мм, с пластиной заземления от 2 мм до 3 мм