0.4mm Pitch, 1.5 to 4.0mm Height, Board-to-Board/FPC-to-Board Connector

1. High Density Mounting
2. Wide Stacking Height Variations
3. High Contact Reliability
4. Robust Design with Shock Absorbing Ribs
5. Wide Self Alignment Range
6. Supports USB4 Gen.2 (20Gbps) transmission
7. Solder Wicking Prevention
8. Mated Design Protects Contacts
9. Compliant with RoHS
10. High-Speed Signal Support, Noise Prevention

Экранированный разъем «плата - плата» / «плата - гибкая печатная плата» с замком с фиксатором, с шагом 0,4 мм / высотой 1,5 мм

[FunctionMAX™]

PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors

1. Pitch : 0.8mm
2. Variations : Right Angle / Parallel / Coplanar
3. Stacking Height : 7/9/10/12mm
4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos.
5. Large Guide for Easy Mating 
6. Unique Contact Design for Smooth Mating
7. Samtec “Edge Rate®” Licensed Second Source

[FunctionMAX™]

High Speed Transmission, 0.8mm Pitch Connectors for PCB Connections

1. 0.8mm pitch
2. Connection type: Coplanar/Right Angle/Parallel (Height: 10 to 45mm)
3. No of Pos.: 40, 60, 80, 100, 120, 140, 160, 180
4. MF (Multi-Functional) contact
5. Effective mating length of 2mm (Signal contact)
6. Resistant to excess mating force
7. Simplified mating with large guides

FX18H
0.8mm Pitch, Open Pluggable Specification (OPS) Compliant 
125℃ Heat-Resistant, Board-to-Board Horizontal Connection Connector

1   Open Pluggable Specification (OPS) Compliant
     OPS is an Intel specification that serves as the industry-wide standard for digital signage, etc.  
2   High-Speed Variation of the FX18 Series
　 Enhancing high-speed performance by optimized contact shapes and configurations of the conventional FX18 Series.
3   125℃ Heat Resistance
4   Compatible Mating and Mounting Pattern with the FX18 Series

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

[FunctionMAX™]

0.4mm Pitch, Small & Floating, Board-to-Board Connector

1. 0.4mm Pitch, Compact, High Pin Count Connector

2. Connection Type: Right Angle Connection

3. Floating Amount: ±0.45mm in the X and Y directions

4. High Speed Transmission: 2.5Gbps

5. Current Capacity: 0.4A/pin

6. Excellent Mating Operation Due to Wide Self-Alignment Guide

7. Effective Fitting Length: 1mm for High Contact Reliability Design

Mirror Mezz, High Speed, Low Height, BGA Mezzanine Connector

1  Molex “Mirror Mezz” Licensed Second Source

2  High Speed Transmission (56⁺Gbps NRZ / 112⁺Gbps PAM4)

3  OAM Specified Connector

4  High Pin Count, High Density : 688pos. (172DPs/in2)

5  Hermaphroditic Connector

6  Stub-less 2-point Contact Design

7   Protective Housing that Encapsulates the Contact Tips
     Prevents Warping During Mating

BGA Mezzanine Connector Supporting 10⁺Gbps

1. Original 3 piece design
2. Stacking Height: 17-42mm
3. Staggered1.5mm×1.75mmball grid array
4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds)
5. Differential, single-ended and power
6. Low mating/extracting forces for easy operability
7. Wide mating misalignment tolerances for multiple connector use
8. Can be used to provide high current when used with IT-P

Высокоскоростной (25⁺Gbps) мезонинный разъём до 300 контактов. Технология пайки BGA (Ball-Grid Array)

Соединительная система мезонинных разъёмов серии IT5 может использоваться как для передачи данных по протоколу PCIe и XAUI, так и в оборудовании, где передача данных превышает 25 Gbps.
Через разъём возможна передача дифференциальных (100 Ом) и одиночных линий (50 Ом) сигналов, а также силовых линий питания. Высота варьируется в диапазоне от 14 до 40 мм.
IT5 серия может помочь вам решить задачи с интерфейсом для нынешних и будущих поколений высокоскоростного оборудования

High-Speed 56Gbps BGA Mezzanine Connectors

[Mechanical Features]

1. Stacking Heights
 Two-piece Type: 10 to 13mm

 Three-piece Type: 14 to 46mm
2. Available with 120, 192, or 288 signal contacts.
3. Multiple Mating Capability
4. Mating Alignment : +/-1.5mm
5. “Pin in Ball” BGA Attachment
6. Compatible with Doublesided and Inverted Reflow Soldering
7. 1.0mm BGA Row Pitch for High Signal Density

[Signal Integrity Features]
8. SI Capability
9. Unique Polarity-Swap FEXT Cancelling Technology

10. Quasi-Coaxial Design

0.5mm Pitch, High Speed Transmission, Right Angle Connector

1  High Speed Transmission (32Gbps)
2  Floating design enables mounting of multiple components on same board
3  Varieties, No. of Pos.: 152pos.

0.5mm Pitch, 21mm Stacking Height,
125℃ Heat Resistant, Floating Board-to-Board Connector

1 Wide ±0.8mm floating range in the X and Y directions
2 High speed transmission (8Gbps)
3 Shield and grounding provide EMI protection
4 Wide self-alignment range : ±1.2mm in X and Y directions
5 Power contacts on each side of the connector (3A/Contact × 4 Contacts)

[FunctionMAX™]

Разъёмы типа плата-плата с шагом 0,5 мм для высокоскоростных сигналов больше 15 Gbps
С этими разъёмами разработан электрический интерфейс для дальнемагистральных модульей передачи данных OIF 100G Long-Haul DWDM