GT8E Series
High Contact Pressure Wire-to-Board Connectors
Features
High contact pressure Wire-to-Board connectors
1.Use of an formed dimple construction at the contact portion, serves to prevent oxidation of the contact portion.2.Design prevents mis-insertions.
3.Stress resisting design.
4.SMT type pin header with pin-in-hole type metal fittings improves PCB retention. High PCB retention force.
Specifications
- Connector Type
- Parts
- Cable Assembly
- Industry Standard
- Safety Standards
- Number of Positions
- Number of Rows (Interface)
- Mounting Pitch
- Contact Pitch
- Connector Length
- Connector Width
- Connector Height
- Mounting Style
- Mounting Side
- PCB Stabilizing Feature
- Staggered Lead
- Recommended PCB Thickness
- Connector Orientation
- Mating/Unmating Cycles
- 30
- Contact Plating
- Plating Thickness
- 0.2, 1.0 μm
- Housing Color
- Wire TerMin.ation Method
- Recommended Wire Type
- Recommended Min. Wire Size (AWG)
- Recommended Max. Wire Size (AWG)
- Recommended Min. Wire Size (mm²)
- Recommended Max. Wire Size (mm²)
- Operating Temperature Max.
- 105 ℃
- Operating Temperature Min.
- -40 ℃
- Panel Mounting Style
Document
In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information.
Catalog
- Series Catalog[Document is missing] Request File