GT8E Series
High Contact Pressure Wire-to-Board Connectors
Features
High contact pressure Wire-to-Board connectors
1.Use of an formed dimple construction at the contact portion, serves to prevent oxidation of the contact portion.
2.Design prevents mis-insertions.
3.Stress resisting design.
4.SMT type pin header with pin-in-hole type metal fittings improves PCB retention. High PCB retention force.
1.Use of an formed dimple construction at the contact portion, serves to prevent oxidation of the contact portion.
2.Design prevents mis-insertions.
3.Stress resisting design.
4.SMT type pin header with pin-in-hole type metal fittings improves PCB retention. High PCB retention force.
Specifications
- Connector Type
- Parts
- Cable Assembly
- Industry Standard
- Safety Standards
- Number of Positions
- Number of Rows (Interface)
- Mounting Pitch
- Contact Pitch
- Connector Length
- Connector Width
- Connector Height
- Mounting Style
- Mounting Side
- PCB Stabilizing Feature
- Staggered Lead
- Recommended PCB Thickness
- Connector Orientation
- Mating/Unmating Cycles
- 30
- Contact Plating
- Plating Thickness
- 0.2, 1.0 μm
- Housing Color
- Wire TerMin.ation Method
- Recommended Wire Type
- Recommended Min. Wire Size (AWG)
- Recommended Max. Wire Size (AWG)
- Recommended Min. Wire Size (mm²)
- Recommended Max. Wire Size (mm²)
- Operating Temperature Max.
- 105 ℃
- Operating Temperature Min.
- -40 ℃
- Panel Mounting Style
Document
In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information.
Catalog
- Series Catalog[Document is missing] Request File