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GT8E Series

High Contact Pressure Wire-to-Board Connectors


Features

High contact pressure Wire-to-Board connectors

1.Use of an formed dimple construction at the contact portion, serves to prevent oxidation of the contact portion.
2.Design prevents mis-insertions.
3.Stress resisting design.
4.SMT type pin header with pin-in-hole type metal fittings improves PCB retention. High PCB retention force.

Specifications

  • Connector Type
  • Parts
  • Cable Assembly
  • No
  • Industry Standard
  • Safety Standards
  • Number of Positions
  • Number of Rows (Interface)
  • Mounting Pitch
  • Contact Pitch
  • Connector Length
  • Connector Width
  • Connector Height
  • Mounting Style
  • Mounting Side
  • PCB Stabilizing Feature
  • Staggered Lead
  • Recommended PCB Thickness
  • Connector Orientation
  • Mating/Unmating Cycles
  • 30
  • Contact Plating
  • Plating Thickness
  • 0.2, 1.0 μm
  • Housing Color
  • Wire TerMin.ation Method
  • Recommended Wire Type
  • Recommended Min. Wire Size (AWG)
  • Recommended Max. Wire Size (AWG)
  • Recommended Min. Wire Size (mm²)
  • Recommended Max. Wire Size (mm²)
  • Operating Temperature Max.
  • 105 ℃
  • Operating Temperature Min.
  • -40 ℃
  • Panel Mounting Style

In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information.

Catalog