0.4mm Pitch, 1.5 to 4.0mm Height, Board-to-Board/FPC-to-Board Connector

1. High Density Mounting
2. Wide Stacking Height Variations
3. High Contact Reliability
4. Robust Design with Shock Absorbing Ribs
5. Wide Self Alignment Range
6. Supports USB4 Gen.2 (20Gbps) transmission
7. Solder Wicking Prevention
8. Mated Design Protects Contacts
9. Compliant with RoHS
10. High-Speed Signal Support, Noise Prevention

0.4mm Pitch, 걸합높이 1.5mm, 완전 Lock, 쉴드 타입 Board to Board/Board to FPC 커넥터

[FunctionMAX™]

PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors

1. Pitch : 0.8mm
2. Variations : Right Angle / Parallel / Coplanar
3. Stacking Height : 7/9/10/12mm
4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos.
5. Large Guide for Easy Mating 
6. Unique Contact Design for Smooth Mating
7. Samtec “Edge Rate®” Licensed Second Source

[FunctionMAX™]

고속 전송 대응, 0.8mm Pitch, Board to Board Connector

1. 0.8mm Pitch
2. 연결 Type : 수평 / 수직 / 평행 (높이:10 ~ 45mm)
3. Pin : 40/60/80/100/120/140/160/180
4. 다양한 용도로 사용 가능한 MF 단자
5. 유효 결합거리 2mm (신호 단자)
6. 커넥터 양쪽의 기판 고정용 딥 단자로 상하좌우뒤틀림을 강화
7. 넓은 Guide 설계로 우수한 결합성

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

[FunctionMAX™]

0.4mm 피치, 소형 및 부동, 보드 대 보드 커넥터

1. 0.4mm 피치, 컴팩트한 고핀 카운트 커넥터

2. 연결 유형: 직각 연결

3. 부력량 : X, Y 방향 ±0.45mm

4. 고속 전송: 2.5Gbps

5. 현재 용량: 0.4A/핀

6. 넓은 자기 정렬 가이드로 인한 뛰어난 교미 작용

7. 유효 피팅 길이: 높은 접촉 신뢰성 설계를 위한 1mm

Card Edge용 0.8mm Pitch, Floating Board to Board Connector

1. Pitch : 0.8mm
2. 높이 : Stakcing Height 22mm MIN
3. Pin : 40/60/80/100/120
4. Floating 가동량 (X축 : ± 0.6mm MAX, Y 축 : ± 0.6mm MAX)
5. 전송 속도 : 2.5Gbps (PCIe-Gen.1)
6. 중계 기판 Customized
7. 전류량 : 0.5A / pin
8. 자동 실장 대응 (흡착 테이프 표준 첨부)
9. 넓은 Guide 설계로 우수한 결합성

0.8mm Pitch, SpeedEdge – High Speed, Card Edge Connector

1 Molex “SpeedEdge” Licensed Second Source
2 25⁺Gbps per differential pair (Supports PCIe Gen.4)
3 Impedance design suitable for both 85Ω and 100Ω systems (92Ω Impedance Target)
4 0.8mm Pitch High Density Mounting

Mirror Mezz, High Speed, Low Height, BGA Mezzanine Connector

1  Molex “Mirror Mezz” Licensed Second Source

2  High Speed Transmission (56⁺Gbps NRZ / 112⁺Gbps PAM4)

3  OAM Specified Connector

4  High Pin Count, High Density : 688pos. (172DPs/in2)

5  Hermaphroditic Connector

6  Stub-less 2-point Contact Design

7   Protective Housing that Encapsulates the Contact Tips
     Prevents Warping During Mating

BGA Mezzanine Connector Supporting 10⁺Gbps

1. Original 3 piece design
2. Stacking Height: 17-42mm
3. Staggered1.5mm×1.75mmball grid array
4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds)
5. Differential, single-ended and power
6. Low mating/extracting forces for easy operability
7. Wide mating misalignment tolerances for multiple connector use
8. Can be used to provide high current when used with IT-P

고속전송 대응 (25+Gbps), BGA 실장, 메자닌 커넥터

1. 독자적인 3-Piece 구조
2. 결합높이 14~40mm
3. BGA 실장 : 지그재그 패턴 1.5mm× 1.75mm BGA (Ball Grid Array)
4. 핀수 : 100, 200, 300 (신호) +110% (추가 그라운드)
5. 차동전송, 싱글엔드 전송, 전원
6. 낮은 삽발력으로 결합 조작성 용이
7. 결합 위치차이 허용량을 크게 설계하여 다수 커넥터 사용 가능
8. Pb-free 사양
9. 양호한 Reflow 실장성

고속 전송용 BGA Mezzanine Connector

[2 Pieces Type]
1. 28+Gbps 고속 차동 신호 대응
2. 85 / 100Ω 대응 가능한 임피던스 설계
3. 실현신뢰성이 높은 BGA 구조 “Pin in Ball”
4. Stackign Heigh : 10,11,12,13mm
5. 복수 실장 허용 구조 ± 0.2mm (X, Y 축)

[3 Pieces Type]
1. 56+Gbps고속 차동 신호 대응
2. 85 / 100Ω 대응 가능한 임피던스 설계
3. 실현신뢰성이 높은 BGA 구조 “Pin in Ball”
4. Stackign Heigh : 14 ~ 46mm
5. 복수 실장 허용 구조 ± 0.2mm (X, Y 축)

0.5mm Pitch, 21mm Stacking Height,
125℃ Heat Resistant, Floating Board-to-Board Connector

1 Wide ±0.8mm floating range in the X and Y directions
2 High speed transmission (8Gbps)
3 Shield and grounding provide EMI protection
4 Wide self-alignment range : ±1.2mm in X and Y directions
5 Power contacts on each side of the connector (3A/Contact × 4 Contacts) 

[FunctionMAX™]

고속전송 대응, 0.5mm Pitch, 결합높이 4~5mm, Board to Board 커넥터
OIF (Optical Internetworking Forum) 100G Long-haul DWDM 광 트랜스미션 모듈 (MSA-100G LH) 표준 커넥터