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0.35mm Pitch, 2.2mm Depth, 0.6mm Stacking Height, High-Frequency, High-Speed, Shielded, Power/Signal Hybrid FPC-to-Board Connector 1. High Power Supply Capacity and Space-saving Design 2. Excellent EMI Prevention with Fully Shielded Design 3. Supports High Speed Transmission (up to 40Gbps) 4. Superior RF Signal Transmission up to 40GHz 5. Robust and Durable Fully Armored Design
Small Floating Board-to-Board Connector, 125ºC Heat Resistance, For Automotive Applications
1. Stacking Height 3.0 to 4.5mm, Floating Range ±0.4mm, World's Smallest Width Class in Floating Board-to-Board Connectors
2. Absorption of Misalignment
3. 125℃ Heat Resistance for Automotive Specifications
4. High Contact Reliability with Two- Point Contact
5. Supports PCI-ex Gen4 (16Gbps) and MIPI D-PHY Ver. 2.1
0.4mm Pitch, 1.5 to 4.0mm Height, Board-to-Board/FPC-to-Board Connector 1. High Density Mounting 2. Wide Stacking Height Variations 3. High Contact Reliability 4. Robust Design with Shock Absorbing Ribs 5. Wide Self Alignment Range 6. Supports USB4 Gen.2 (20Gbps) transmission 7. Solder Wicking Prevention 8. Mated Design Protects Contacts 9. Compliant with RoHS 10. High-Speed Signal Support, Noise Prevention
Small Floating Board-to-Board Connector, 125ºC Heat Resistance for Automotive 【DF40F】
1. 0.4mm Pitch, 3.68mm Width,Stacking Height 3.5 to 6.0mm World' s Smallest Width Classin Floating Board-to-Board Connectors 2. Absorption of Misalignment 3. Wide Variety of Stacking Heights by Mating Combination with DF40T 4. 125℃ Heat Resistance for Automotive Specifications 5. Supports High Speed Transmission
0.4mm Pitch, 걸합높이 1.5mm, 완전 Lock, 쉴드 타입 Board to Board/Board to FPC 커넥터
0.4mm Pitch, 3.38mm Depth, 125ºC Heat Resistance, Board-to-Board/FPC-to-Board Connector for Automotive 【DF40T/DF40GT】
1. Space-saving Design and Wide Variations 2. 125℃ Heat Resistant Contact Design 3. World Longest Class Effective Mating Length 4. Guide Ribs for Wide Self Alignment Range 5. Satisfies PCI Express 4.0 (16Gbps) 6. Metal Shielding for Superior EMI 【DF40GT】 7. Reliable Ground Design 【DF40GT】
PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors
1. Pitch : 0.8mm 2. Variations : Right Angle / Parallel / Coplanar 3. Stacking Height : 7/9/10/12mm 4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos. 5. Large Guide for Easy Mating 6. Unique Contact Design for Smooth Mating 7. Samtec “Edge Rate®” Licensed Second Source
고속 전송 대응, 0.8mm Pitch, Board to Board Connector
1. 0.8mm Pitch 2. 연결 Type : 수평 / 수직 / 평행 (높이:10 ~ 45mm) 3. Pin : 40/60/80/100/120/140/160/180 4. 다양한 용도로 사용 가능한 MF 단자 5. 유효 결합거리 2mm (신호 단자) 6. 커넥터 양쪽의 기판 고정용 딥 단자로 상하좌우뒤틀림을 강화 7. 넓은 Guide 설계로 우수한 결합성
1. Pitch: 0.5mm 2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle 3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power 4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm 5. Supports PCle Gen.4 (16Gbps) 6. Hybrid Power Design (3A/pin×4 lines) 7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin 8. Pick & Place (suction tape attached as standard) 9. Large guide post for excellent mating performance
Card Edge용 0.8mm Pitch, Floating Board to Board Connector
1. Pitch : 0.8mm 2. 높이 : Stakcing Height 22mm MIN 3. Pin : 40/60/80/100/120 4. Floating 가동량 (X축 : ± 0.6mm MAX, Y 축 : ± 0.6mm MAX) 5. 전송 속도 : 2.5Gbps (PCIe-Gen.1) 6. 중계 기판 Customized 7. 전류량 : 0.5A / pin 8. 자동 실장 대응 (흡착 테이프 표준 첨부) 9. 넓은 Guide 설계로 우수한 결합성
0.8mm Pitch, SpeedEdge – High Speed, Card Edge Connector 1 Molex “SpeedEdge” Licensed Second Source 2 25⁺Gbps per differential pair (Supports PCIe Gen.4) 3 Impedance design suitable for both 85Ω and 100Ω systems (92Ω Impedance Target) 4 0.8mm Pitch High Density Mounting
Mirror Mezz, High Speed, Low Height, BGA Mezzanine Connector
1 Molex “Mirror Mezz” Licensed Second Source
2 High Speed Transmission (56⁺Gbps NRZ / 112⁺Gbps PAM4)
3 OAM Specified Connector
4 High Pin Count, High Density : 688pos. (172DPs/in2)
5 Hermaphroditic Connector
6 Stub-less 2-point Contact Design
7 Protective Housing that Encapsulates the Contact Tips Prevents Warping During Mating
BGA Mezzanine Connector Supporting 10⁺Gbps 1. Original 3 piece design 2. Stacking Height: 17-42mm 3. Staggered1.5mm×1.75mmball grid array 4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds) 5. Differential, single-ended and power 6. Low mating/extracting forces for easy operability 7. Wide mating misalignment tolerances for multiple connector use 8. Can be used to provide high current when used with IT-P
고속전송 대응 (25+Gbps), BGA 실장, 메자닌 커넥터 1. 독자적인 3-Piece 구조 2. 결합높이 14~40mm 3. BGA 실장 : 지그재그 패턴 1.5mm× 1.75mm BGA (Ball Grid Array) 4. 핀수 : 100, 200, 300 (신호) +110% (추가 그라운드) 5. 차동전송, 싱글엔드 전송, 전원 6. 낮은 삽발력으로 결합 조작성 용이 7. 결합 위치차이 허용량을 크게 설계하여 다수 커넥터 사용 가능 8. Pb-free 사양 9. 양호한 Reflow 실장성
고속 전송용 BGA Mezzanine Connector
[2 Pieces Type] 1. 28+Gbps 고속 차동 신호 대응 2. 85 / 100Ω 대응 가능한 임피던스 설계 3. 실현신뢰성이 높은 BGA 구조 “Pin in Ball” 4. Stackign Heigh : 10,11,12,13mm 5. 복수 실장 허용 구조 ± 0.2mm (X, Y 축)
[3 Pieces Type] 1. 56+Gbps고속 차동 신호 대응 2. 85 / 100Ω 대응 가능한 임피던스 설계 3. 실현신뢰성이 높은 BGA 구조 “Pin in Ball” 4. Stackign Heigh : 14 ~ 46mm 5. 복수 실장 허용 구조 ± 0.2mm (X, Y 축)
0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector
1 Wide ±0.8mm floating range in the X and Y directions 2 High speed transmission (8Gbps) 3 Shield and grounding provide EMI protection 4 Wide self-alignment range : ±1.2mm in X and Y directions 5 Power contacts on each side of the connector (3A/Contact × 4 Contacts)
고속전송 대응, 0.5mm Pitch, 결합높이 4~5mm, Board to Board 커넥터 OIF (Optical Internetworking Forum) 100G Long-haul DWDM 광 트랜스미션 모듈 (MSA-100G LH) 표준 커넥터
고속전송 대응, 0.5mm Pitch, 결합높이 2~3mm, Board to Board 커넥터
