[FunctionMAX™]

PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors

1. Pitch : 0.8mm
2. Variations : Right Angle / Parallel / Coplanar
3. Stacking Height : 7/9/10/12mm
4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos.
5. Large Guide for Easy Mating 
6. Unique Contact Design for Smooth Mating
7. Samtec “Edge Rate®” Licensed Second Source

[FunctionMAX™]

对应高速传输 0.8mm间距板对板连接器

1. 0.8mm间距
2. 连接方式：共面/垂直/平行（高度：10-45mm）
3. 芯数：40/60/80/100/120/140/160/180
4. MF端子，可用于多种用途
5. 有效嵌合长度2mm（信号端子）
6. 固定于基板的连接器两侧的Dip端子可增强上下・左右耐扭曲力。
7. 导向设计便于嵌合

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

BGA Mezzanine Connector Supporting 10⁺Gbps

1. Original 3 piece design
2. Stacking Height: 17-42mm
3. Staggered1.5mm×1.75mmball grid array
4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds)
5. Differential, single-ended and power
6. Low mating/extracting forces for easy operability
7. Wide mating misalignment tolerances for multiple connector use
8. Can be used to provide high current when used with IT-P

支持高速传输（25⁺Gbps）BGA Mezzanine连接器

广濑IT5转接连接器系统可对应于未来的25+ Gbps系统应用要求以及当今PCIe以及XAUI需求的数据传输速率. 因为它的差分单端传输能力，以及整体的通过电流以及多样化的装配高度14-40mm, IT5可同时解决接口对电流以及未来更新换代的需求

高速传输 BGA夹层连接器

【2片式】
1. 可对应高达28⁺Gbps的高速差分信号
2. 对应85/100Ω两种阻抗设计
3. 实装可靠性高的BGA构造“Pin in Ball”
4. 叠装高度：10,11,12,13mm
5. 允许多个实装构造±0.2mm（X,Y方向）

【3片式】
1. 可对应高达56⁺Gbps的高速差分信号
2. 对应85/100Ω两种阻抗设计
3. 实装可靠性高的BGA构造“Pin in Ball”
4. 叠装高度：14～46mm
5. 允许多个实装构造±0.2mm（X,Y方向）

0.5mm Pitch High Speed Transmission, Right Angle Connector

1 High Speed Transmission (32⁺Gbps)
2 High Density : 50 Differential Pairs/Inch (224pos.)
3 Floating design enables mounting of multiple components on same board
4 Wide Varieties - No. of Pos.: 84pos., 152pos., 224pos.

[FunctionMAX™]

15Gbps或更高的传输速率，0.5mm引脚间距装配连接器
对应OIF的100G电气接口长距离DWDM传输模块(MSA-100GLH)