0.35mm Pitch, 2.2mm Depth, 0.6mm Stacking Height, High-Frequency, High-Speed,
Shielded, Power/Signal Hybrid FPC-to-Board Connector

1. High Power Supply Capacity and Space-saving Design
2. Excellent EMI Prevention with Fully Shielded Design
3. Supports High Speed Transmission (up to 40Gbps)
4. Superior RF Signal Transmission up to 40GHz
5. Robust and Durable Fully Armored Design

Small Floating Board-to-Board Connector,
125ºC Heat Resistance, For Automotive Applications

1. Stacking Height 3.0 to 4.5mm, Floating Range ±0.4mm, World's Smallest Width Class in Floating Board-to-Board Connectors

2. Absorption of Misalignment

3. 125℃ Heat Resistance for Automotive Specifications

4. High Contact Reliability with Two- Point Contact

5. Supports PCI-ex Gen4 (16Gbps) and MIPI D-PHY Ver. 2.1

0.4mm Pitch, 1.5 to 4.0mm Height, Board-to-Board/FPC-to-Board Connector

1. High Density Mounting
2. Wide Stacking Height Variations
3. High Contact Reliability
4. Robust Design with Shock Absorbing Ribs
5. Wide Self Alignment Range
6. Supports USB4 Gen.2 (20Gbps) transmission
7. Solder Wicking Prevention
8. Mated Design Protects Contacts
9. Compliant with RoHS
10. High-Speed Signal Support, Noise Prevention

Small Floating Board-to-Board Connector,
125ºC Heat Resistance for Automotive
【DF40F】

1. 0.4mm Pitch, 3.68mm Width,Stacking Height 3.5 to 6.0mm
　 World' s Smallest Width Classin Floating Board-to-Board Connectors
2. Absorption of Misalignment
3. Wide Variety of Stacking Heights by Mating Combination with DF40T
4. 125℃ Heat Resistance for Automotive Specifications
5. Supports High Speed Transmission

0.4mm间距 1.5mm高 完全锁扣＆屏蔽型 基板对基板／基板对FPC用连接器

0.4mm Pitch, 3.38mm Depth, 125ºC Heat Resistance,
Board-to-Board/FPC-to-Board Connector for Automotive
【DF40T/DF40GT】

1. Space-saving Design and Wide Variations
2. 125℃ Heat Resistant Contact Design
3. World Longest Class Effective Mating Length
4. Guide Ribs for Wide Self Alignment Range
5. Satisfies PCI Express 4.0 (16Gbps)
6. Metal Shielding for Superior EMI 【DF40GT】
7. Reliable Ground Design 【DF40GT】

Small Floating Board-to-Board Connector,
125ºC Heat Resistance for Automotive
【DF40F】

1. 0.4mm Pitch, 3.68mm Width,Stacking Height 3.5 to 6.0mm
　 World' s Smallest Width Classin Floating Board-to-Board Connectors
2. Absorption of Misalignment
3. Wide Variety of Stacking Heights by Mating Combination with DF40T
4. 125℃ Heat Resistance for Automotive Specifications
5. Supports High Speed Transmission

[FunctionMAX™]

PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors

1. Pitch : 0.8mm
2. Variations : Right Angle / Parallel / Coplanar
3. Stacking Height : 7/9/10/12mm
4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos.
5. Large Guide for Easy Mating 
6. Unique Contact Design for Smooth Mating
7. Samtec “Edge Rate®” Licensed Second Source

[FunctionMAX™]

对应高速传输 0.8mm间距板对板连接器

1. 0.8mm间距
2. 连接方式：共面/垂直/平行（高度：10-45mm）
3. 芯数：40/60/80/100/120/140/160/180
4. MF端子，可用于多种用途
5. 有效嵌合长度2mm（信号端子）
6. 固定于基板的连接器两侧的Dip端子可增强上下・左右耐扭曲力。
7. 导向设计便于嵌合

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

[FunctionMAX™]

卡缘连接 0.8mm间距 基板间连接用浮动连接器

1. 端子分布间距：0.8mm
2. 高度自由：堆叠高度22mmMIN
3. 芯数：40/60/80/100/120
4. 浮动可变量
    Ｘ方向：±0.6mmMAX，Ｙ方向 ：±0.6mmMAX
5. 传输速度：2.5Gbps（PCIe-Gen.1）
6. 中继基板定制
7. 电流容量：0.5A/pin
8. 对应自动实装（标准贴附吸着胶带）
9. 大的导向结构使其具有优越的嵌合性

0.8mm Pitch, SpeedEdge – High Speed, Card Edge Connector

1 Molex “SpeedEdge” Licensed Second Source
2 25⁺Gbps per differential pair (Supports PCIe Gen.4)
3 Impedance design suitable for both 85Ω and 100Ω systems (92Ω Impedance Target)
4 0.8mm Pitch High Density Mounting

1.支持高速传输 (对应56+Gbps NRZ / 112+Gbps PAM4)

2.OAM标准连接器

3.多芯高密度设计 : 688芯 (172DPs/in2)

4.雌雄同体設計、无短线柱双触点构造

5.外壳保护端子前端，防止嵌合时弯曲

6.MOLEX公司「Mirror Mezz」许可的第二供应商

BGA Mezzanine Connector Supporting 10⁺Gbps

1. Original 3 piece design
2. Stacking Height: 17-42mm
3. Staggered1.5mm×1.75mmball grid array
4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds)
5. Differential, single-ended and power
6. Low mating/extracting forces for easy operability
7. Wide mating misalignment tolerances for multiple connector use
8. Can be used to provide high current when used with IT-P

支持高速传输（25⁺Gbps）BGA Mezzanine连接器

广濑IT5转接连接器系统可对应于未来的25+ Gbps系统应用要求以及当今PCIe以及XAUI需求的数据传输速率. 因为它的差分单端传输能力，以及整体的通过电流以及多样化的装配高度14-40mm, IT5可同时解决接口对电流以及未来更新换代的需求

高速传输 BGA夹层连接器

【2片式】
1. 可对应高达28⁺Gbps的高速差分信号
2. 对应85/100Ω两种阻抗设计
3. 实装可靠性高的BGA构造“Pin in Ball”
4. 叠装高度：10,11,12,13mm
5. 允许多个实装构造±0.2mm（X,Y方向）

【3片式】
1. 可对应高达56⁺Gbps的高速差分信号
2. 对应85/100Ω两种阻抗设计
3. 实装可靠性高的BGA构造“Pin in Ball”
4. 叠装高度：14～46mm
5. 允许多个实装构造±0.2mm（X,Y方向）

0.5mm Pitch High Speed Transmission, Right Angle Connector

1 High Speed Transmission (32⁺Gbps)
2 High Density : 50 Differential Pairs/Inch (224pos.)
3 Floating design enables mounting of multiple components on same board
4 Wide Varieties - No. of Pos.: 84pos., 152pos., 224pos.

0.5mm Pitch, 21mm Stacking Height,
125℃ Heat Resistant, Floating Board-to-Board Connector

1 Wide ±0.8mm floating range in the X and Y directions
2 High speed transmission (8Gbps)
3 Shield and grounding provide EMI protection
4 Wide self-alignment range : ±1.2mm in X and Y directions
5 Power contacts on each side of the connector (3A/Contact × 4 Contacts)

[FunctionMAX™]

15Gbps或更高的传输速率，0.5mm引脚间距装配连接器
对应OIF的100G电气接口长距离DWDM传输模块(MSA-100GLH)

[FunctionMAX™]

支持高速传输、0.5mm间距、基板间2~3mm连接用连接器

1. 薄型连接器
2. 带接地板对板连接器
3. 信号:接地=10:1
4. 带提高焊接剥离强度的补强金具
5. 支持高密度实装
6. 防止爬锡构造
7. 接触可靠性
8. 无接地板型