0.35mm Pitch, 2.2mm Depth, 0.6mm Stacking Height, High-Frequency, High-Speed,
Shielded, Power/Signal Hybrid FPC-to-Board Connector

1. High Power Supply Capacity and Space-saving Design
2. Excellent EMI Prevention with Fully Shielded Design
3. Supports High Speed Transmission (up to 40Gbps)
4. Superior RF Signal Transmission up to 40GHz
5. Robust and Durable Fully Armored Design

Small Floating Board-to-Board Connector,
125ºC Heat Resistance, For Automotive Applications

1. Stacking Height 3.0 to 4.5mm, Floating Range ±0.4mm, World's Smallest Width Class in Floating Board-to-Board Connectors

2. Absorption of Misalignment

3. 125℃ Heat Resistance for Automotive Specifications

4. High Contact Reliability with Two- Point Contact

5. Supports PCI-ex Gen4 (16Gbps) and MIPI D-PHY Ver. 2.1

0.4mm Pitch, 1.5 to 4.0mm Height, Board-to-Board/FPC-to-Board Connector

1. High Density Mounting
2. Wide Stacking Height Variations
3. High Contact Reliability
4. Robust Design with Shock Absorbing Ribs
5. Wide Self Alignment Range
6. Supports USB4 Gen.2 (20Gbps) transmission
7. Solder Wicking Prevention
8. Mated Design Protects Contacts
9. Compliant with RoHS
10. High-Speed Signal Support, Noise Prevention

Small Floating Board-to-Board Connector,
125ºC Heat Resistance for Automotive
【DF40F】

1. 0.4mm Pitch, 3.68mm Width,Stacking Height 3.5 to 6.0mm
　 World' s Smallest Width Class in Floating Board-to-Board Connectors
2. Absorption of Misalignment
3. Wide Variety of Stacking Heights by Mating Combination with DF40T
4. 125℃ Heat Resistance for Automotive Specifications
5. Supports High Speed Transmission

Pas de 0,4mm, 1,5mm de hauteur, verrouillage positif, connecteur carte-à-carte et carte à nappe FPC blindés

0.4mm Pitch, 3.38mm Depth, 125ºC Heat Resistance,
Board to Board/FPC to Board Connector for Automotive
【DF40T/DF40GT】

1. Space-saving Design and Wide Variations
2. 125℃ Heat Resistant Contact Design
3. World Longest Class Effective Mating Length
4. Guide Ribs for Wide Self Alignment Range
5. Supports PCI-ex Gen4(16Gbps)
6. Metal Shielding for Superior EMI 【DF40GT】
7. Reliable Ground Design 【DF40GT】

Small Floating Board to Board Connector, 125ºC Heat Resistance for Automotive

【DF40F】

1. 0.4mm Pitch, 3.68mm Width, Stacking Height 3.5 to 6.0mm World's Smallest Width Class in Floating Board to Board Connectors
2. Absorption of Misalignment
3. Wide Variety of Stacking Heights by Mating Combination with DF40T
4. 125℃ Heat Resistance for Automotive Specifications
5. Supports High Speed Transmission

[FunctionMAX™]

PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors

1. Pitch : 0.8mm
2. Variations : Right Angle / Parallel / Coplanar
3. Stacking Height : 7/9/10/12mm
4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos.
5. Large Guide for Easy Mating 
6. Unique Contact Design for Smooth Mating
7. Samtec “Edge Rate®” Licensed Second Source

[FunctionMAX™]

High Speed Transmission, 0.8mm Pitch Connectors for PCB Connections

1. 0.8mm pitch
2. Connection type: Coplanar/Right Angle/Parallel (Height: 10 to 45mm)
3. No of Pos.: 40, 60, 80, 100, 120, 140, 160, 180
4. MF (Multi-Functional) contact
5. Effective mating length of 2mm (Signal contact)
6. Resistant to excess mating force
7. Simplified mating with large guides

FX18H
0.8mm Pitch, Open Pluggable Specification 2.0 (OPS 2.0) Standard Connector
125℃ Heat-Resistant, Board-to-Board Horizontal Connection Connector

1   Open Pluggable Specification 2.0 (OPS 2.0) Standard Connector
     OPS is an Intel specification that serves as the industry-wide standard for digital signage, etc.  
2   High-Speed Variation of the FX18 Series
　 Enhancing high-speed performance by optimized contact shapes and configurations of the conventional FX18 Series.
3   125℃ Heat Resistance
4   Compatible Mating and Mounting Pattern with the FX18 Series

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm ; Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance

High Speed Transmission, 0.5mm Pitch
Board-to-Board Floating Connectors

1. Pitch: 0.5mm
2. Connection Type: Stacking (Height : 8 to 30mm)/Right Angle
3. Positions Available: 20/40/60/80/100/120 for signal + 4 pins for power
4. Floating Range: X Direction : ±0.6mm  Y direction: ±0.6mm
5. Supports PCle Gen.4 (16Gbps)
6. Hybrid Power Design (3A/pin×4 lines)
7. Current Capacity: Signal Contact 0.5A/pin  Power Contact 3A/pin
8. Pick & Place (suction tape attached as standard)
9. Large guide post for excellent mating performance
 

FX23LH

125℃, Floating Board-to-Board Connector with Power Contacts
1  Floating range: ±0.6mm in X and Y directions
2  High speed transmission capability
    Supports PCIe Gen.4 (16Gbps)
3  Supports 125℃ to meet automotive specs.
4  SMT mounting increases flexibility in component placement
5  Compatible Mating with FX23/FX23L

[FunctionMAX™]

Connecteur flottant de bord de carte au pas de 0,8 mm

1. Pas de 0,8 mm
2. Hauteur d'empilement: 22 mm Min.
3. Nombre de contacts: 40/60/80/100/120
4. Rattrapage de jeux: ± 0,6 mm Max. dans les directions X et Y
5. Transmission haut débit: 2,5 Gbps (PCle-Gen.1)
6. PCB interposeur personnalisable
7. Capacité de courant: 0.5A / pin
8. Montage automatique (standard avec adhésif pour l'aspiration)
9. Excellentes performances d'accouplement grâce aux larges pions de guidage.

Mirror Mezz, High Speed, Low Height, BGA Mezzanine Connector

1  Molex “Mirror Mezz” Licensed Second Source

2  High Speed Transmission (56⁺Gbps NRZ / 112⁺Gbps PAM4)

3  OAM Specified Connector

4  High Pin Count, High Density:
    404pos. (101 Differential Pairs), 688pos. (172 Differential Pairs)

5  Hermaphroditic Connector

6  Stub-less 2-point Contact Design

7   Protective Housing that Encapsulates the Contact Tips
     Prevents Warping During Mating

COM-HPC^® Standard Compatible, Ultra High Density,
Low Profile BGA Mezzanine Connector
​​​​​​​
1．COM-HPC^® Standard Compatible Connector​ (Version with weld tabs)
2．High Speed Transmission:​
　   PCIe Gen5(32GT/s), Gen6(64GT/s PAM4), 100Gb Ethernet​ (4×25Gb)
3．Low Profile Design
　   Available in 5mm and 10mm stacking heights
4．High Pin Count and Density: 400 positions (0.635mm Pitch)
5．Open Pin-field Layout
　   Flexible pin mapping for various system architectures
​​​6．Reliable BGA Termination​
　   Pin-in-ball structure ensures high mounting reliability
​7．Officially Licensed COM-HPC^® Connector by Samtec

BGA Mezzanine Connector Supporting 10⁺Gbps

1. Original 3 piece design
2. Stacking Height: 17-42mm
3. Staggered1.5mm×1.75mmball grid array
4. No.of Pos.: 100,200,300(Signal)+ 90％(Additional Grounds)
5. Differential, single-ended and power
6. Low mating/extracting forces for easy operability
7. Wide mating misalignment tolerances for multiple connector use
8. Can be used to provide high current when used with IT-P

Connecteurs Mezzanine BGA à haut débit (25⁺Gbps)

Les connecteurs mezzanine IT5 de Hirose sont aussi à l'aise dans les transmissions de données d'aujourd'hui PCIe et XAUI comme dans les solutions de demain nécessitant 25+ Gbps. Avec la possibilité de transmettre des signaux différentiels, des signaux simples et de la puissance dans un même connecteur, et d'avoir une hauteur d'empilement de 14 à 40 mm, la série IT5 peut résoudre vos besoins d'interface d'aujourd'hui et pour les générations futures.

Connecteurs mezzanine BGA 56 Gbit/s haut débit

[Caractéristiques mécaniques]

1. Hauteur d'empilement
 Type de deux pièces : 10 à 13 mm

Type de trois pièces : 14 à 46 mm
2. Disponible avec 120, 192 ou 288 contacts de signal.
3. Fonctionnalité d'association multiple
4. Alignement d'association : +/-1,5 mm
5. Attache BGA "Pin in Ball"
6. Compatible avec le soudage à double face et inversé
7. Pas de ligne BGA de 1,0 mm pour une densité de signal élevée

[Fonctionnalités d'intégrité du signal]
8. Fonctionnalité SI
9. Technologie d'annulation FEXT Polarity-Swap unique

10 Conception Quasi-Coaxiale

0.5mm Pitch, High Speed Transmission, Right Angle Connector

1  High Speed Transmission (32Gbps)
2  Floating design enables mounting of multiple components on same board
3  Varieties, No. of Pos.: 152pos.

0.5mm Pitch, 21mm Stacking Height,
125℃ Heat Resistant, Floating Board-to-Board Connector

1 Wide ±0.8mm floating range in the X and Y directions
2 High speed transmission (8Gbps)
3 Shield and grounding provide EMI protection
4 Wide self-alignment range : ±1.2mm in X and Y directions
5 Power contacts on each side of the connector (3A/Contact × 4 Contacts)

[FunctionMAX™]

Connecteurs carte à carte au pas de 0,5 mm, 15+ Gbps
Interface électrique pour le module de transmission longue distance OIF 100G, DWDM (MSA-100GLH)

[FunctionMAX™]

Connecteurs carte à carte au pas de 0,5 mm, pour transmissions à haut débit avec plaque de masse, et une hauteur d'empilement de 2 à 3 mm